14 results
Underground nuclear astrophysics experiment JUNA in China
-
- Journal:
- Proceedings of the International Astronomical Union / Volume 15 / Issue S350 / April 2019
- Published online by Cambridge University Press:
- 12 October 2020, pp. 313-320
- Print publication:
- April 2019
-
- Article
-
- You have access
- Export citation
Package Reliability Analysis with Coupled Electro-Thermal and Mechanical Modeling
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1559 / 2013
- Published online by Cambridge University Press:
- 31 May 2013, mrss13-1559-aa08-05
- Print publication:
- 2013
-
- Article
- Export citation
Silicon Interposer Reliability Optimization through Process-Oriented Stress Modeling
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1428 / 2012
- Published online by Cambridge University Press:
- 30 July 2012, mrss12-1428-c10-04
- Print publication:
- 2012
-
- Article
- Export citation
Elastic anisotropy of Cu and its impact on stress management for 3D IC: Nanoindentation and TCAD simulation study
-
- Journal:
- Journal of Materials Research / Volume 27 / Issue 1 / 14 January 2012
- Published online by Cambridge University Press:
- 21 October 2011, pp. 339-348
- Print publication:
- 14 January 2012
-
- Article
- Export citation
Microbump Impact on Reliability and Performance in Through-Silicon Via Stacks
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1335 / 2011
- Published online by Cambridge University Press:
- 10 August 2011, mrss11-1335-o08-05
- Print publication:
- 2011
-
- Article
- Export citation
Material, Process and Geometry Effects on Through-Silicon Via Reliability and Isolation
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1249 / 2010
- Published online by Cambridge University Press:
- 01 February 2011, 1249-F09-08
- Print publication:
- 2010
-
- Article
- Export citation
Viscoelastic Modeling and Reliability Assessment of Microelectronics Packages
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1158 / 2009
- Published online by Cambridge University Press:
- 31 January 2011, 1158-F01-08
- Print publication:
- 2009
-
- Article
- Export citation
Numerical Analysis of Packaging-Induced Failures in Cu/Low-k Interconnects
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 1079 / 2008
- Published online by Cambridge University Press:
- 01 February 2011, 1079-N09-09
- Print publication:
- 2008
-
- Article
- Export citation
Impact of Fabrication Process, Layout Variation and Packaging Process on Cu/Low-k Interconnect Reliability
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 990 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0990-B10-02
- Print publication:
- 2007
-
- Article
- Export citation
Modeling the Impact of Layout Variation on Process Stress in Cu/Low k Interconnects
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 914 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0914-F03-03
- Print publication:
- 2006
-
- Article
- Export citation
Modeling the Impact of Packaging Stress on Device Performance
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 863 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, B8.25
- Print publication:
- 2005
-
- Article
- Export citation
Three Dimensional Interconnect Stress Modeling for Back End Process
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 812 / 2004
- Published online by Cambridge University Press:
- 17 March 2011, F6.25
- Print publication:
- 2004
-
- Article
- Export citation
Three Dimensional Modeling of Anisotropic Stress Effects in Thermal Oxidation of Silicon
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 731 / 2002
- Published online by Cambridge University Press:
- 01 February 2011, W8.5
- Print publication:
- 2002
-
- Article
- Export citation