9 results
A study of ruthenium ultrathin film nucleation on pretreated SiO2 and Hf–silicate dielectric surfaces
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- Journal:
- Journal of Materials Research / Volume 22 / Issue 8 / August 2007
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2254-2264
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- August 2007
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Low-temperature plasma-enhanced atomic layer deposition growth of WNxCy from a novel precursor for barrier applications in nanoscale devices
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- Journal of Materials Research / Volume 22 / Issue 3 / March 2007
- Published online by Cambridge University Press:
- 03 March 2011, pp. 703-709
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- March 2007
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Electrical Properties of Ultrathin Al2O3 Films Grown by Metalorganic Chemical Vapor Deposition for Advanced Complementary Metal-oxide Semiconductor Gate Dielectric Applications
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- Journal of Materials Research / Volume 20 / Issue 6 / June 2005
- Published online by Cambridge University Press:
- 01 June 2005, pp. 1536-1543
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- June 2005
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Chemical vapor deposition of ruthenium and ruthenium oxide thin films for advanced complementary metal-oxide semiconductor gate electrode applications
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- Journal:
- Journal of Materials Research / Volume 19 / Issue 10 / October 2004
- Published online by Cambridge University Press:
- 01 October 2004, pp. 2947-2955
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- October 2004
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Atomic layer deposition of tantalum nitride for ultrathin liner applications in advanced copper metallization schemes
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- Journal:
- Journal of Materials Research / Volume 19 / Issue 2 / February 2004
- Published online by Cambridge University Press:
- 03 March 2011, pp. 447-453
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- February 2004
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Low-temperature metalorganic chemical vapor deposition of Al2O3 for advanced complementary metal-oxide semiconductor gate dielectric applications
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- Journal:
- Journal of Materials Research / Volume 18 / Issue 8 / August 2003
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1868-1876
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- August 2003
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The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum-Based Thin Films for Copper Diffusion Barrier Applications
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- Journal:
- MRS Online Proceedings Library Archive / Volume 766 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, E10.4
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- 2003
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Metalorganic chemical vapor deposition of titanium oxide for microelectronics applications
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- Journal:
- Journal of Materials Research / Volume 16 / Issue 6 / June 2001
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1838-1849
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- June 2001
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The 2,2,6,6-Tetramethyl-2-Sila-3,5-Heptanedione Route to the Chemical Vapor Deposition of Copper for Gigascale Interconnect Applications
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- Journal:
- MRS Online Proceedings Library Archive / Volume 612 / 2000
- Published online by Cambridge University Press:
- 17 March 2011, D6.8.1
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- 2000
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