In a multi-project wafer process your layout will be included with other users' layouts that are combined together into a wafer level layout. All of the designs will be fabricated together using the same process. When all of the fabrication steps have been completed the wafer is subdivided into individual dies for each of the users using an abrasive diamond saw. Dicing “streets” are put in at the wafer level layout by the supplier to comprehend the “kerf ” (width) of the saw blade and a safety zone for chipping during the sawing operation. The saw blade and wafer are sprayed with water to keep them cool during the dicing operation, and the sawing process generates residual particles that must be removed in a post-sawing cleaning step. At this stage custom steps can be performed for each individual customer at the die level. Some of the custom steps include sub-dicing of the individual die into smaller pieces, post-processing steps such as sacrificial release and critical point drying, and packaging of the parts. Packaging can include attaching the die to a carrier, wire bonding and sealing the package to protect the parts from the environment and to provide a controlled interface (electrical, thermal, mechanical, and/or optical) between the parts and the environment.