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13 - Thermomigration

Published online by Cambridge University Press:  05 July 2014

King-Ning Tu
Affiliation:
University of California, Los Angeles
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Summary

Introduction

When an inhomogeneous binary solid solution or alloy is annealed at constant temperature and constant pressure, it will become homogeneous to lower the free energy. Conversely, when a homogeneous binary alloy is annealed at constant pressure but under a temperature gradient, i.e. one end of it is hotter than the other, the opposite will happen: the alloy will become inhomogeneous, and the free energy increases. This de-alloying phenomenon is called the Soret effect, as mentioned in Chapter 10. It is due to thermomigration or mass migration driven by a temperature gradient [1–3]. Since the inhomogeneous alloy has higher free energy than the homogeneous alloy, thermomigration is an energetic process which transforms a phase from a low-energy to a high-energy state. It is unlike a conventional phase transformation which occurs by lowering Gibbs free energy.

In thermodynamics, under homogeneous external conditions defined by a constant temperature and constant pressure (for example, if T is fixed at 100 °C and p is fixed at atmospheric pressure), a thermodynamic system will minimize its Gibbs free energy, and it will move toward the equilibrium condition at the given T and p. Both enthalpy and entropy are state functions, so the Gibbs free energy of the equilibrium state is defined when T and p are given. On the other hand, if the external conditions are inhomogeneous, for example, having different temperatures at the two ends of a sample in thermomigration, the equilibrium state of minimum Gibbs free energy is unattainable.

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Publisher: Cambridge University Press
Print publication year: 2010

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References

[1] Paul, Shewmon, “Diffusion in solids,” Ch. 7 of “Thermo- and Electro-Transport in Solids” (TMS, Warrendale, PA, 1989).Google Scholar
[2] D. V., Ragone, “Thermodynamics of materials,” Vol. II, Ch. 8 of Nonequilibrium Thermodynamics (Wiley, New York, 1995).Google Scholar
[3] R. W., Balluffi, S. M., Allen and W. C., Carter, “Irreversible thermodynamics: coupled forces and fluxes,” Ch. 2 of Kinetics of Materials (Wiley-Interscience, Hoboken, NJ, 2005).Google Scholar
[4] W., Roush and J., Jaspal, “Thermomigration in Pb-In solder,” IEEE Proc. CH1781 (1982), 342–45.Google Scholar
[5] D. R., Campbell, K. N., Tu and R. E., Robinson, “Interdiffusion in a bulk couple of Pb-PbIn alloy,” Acta Met. 24 (1976), 609.Google Scholar
[6] H., Ye, C., Basaran and D. C., Hopkins, “Thermomigration in Pb-Sn solder joints under joule heating during electric current stressing,” Appl. Phys. Lett. 82 (2003), 1045–7.Google Scholar
[7] Y. C., Chuang and C. Y., Liu, “Thermomigration in eutectic SnPb alloy,” Appl. Phys. Lett. 88 (2006), 174105.Google Scholar
[8] Hsiang-Yao, Hsiao and Chih, Chen, “Thermomigration in Pb-free SnAg solder joint under alternating current stressing,” Appl. Phys. Lett. 94 (2009), 092107.Google Scholar
[9] Annie, Huang, A. M., Gusak, K. N., Tu and Yi-Shao, Lai, “Thermomigration in SnPb composite flip-chip solder joints,” Appl. Phys. Lett. 88 (2006), 141911.Google Scholar

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  • Thermomigration
  • King-Ning Tu, University of California, Los Angeles
  • Book: Electronic Thin-Film Reliability
  • Online publication: 05 July 2014
  • Chapter DOI: https://doi.org/10.1017/CBO9780511777691.014
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  • Thermomigration
  • King-Ning Tu, University of California, Los Angeles
  • Book: Electronic Thin-Film Reliability
  • Online publication: 05 July 2014
  • Chapter DOI: https://doi.org/10.1017/CBO9780511777691.014
Available formats
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Save book to Google Drive

To save content items to your account, please confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your account. Find out more about saving content to Google Drive.

  • Thermomigration
  • King-Ning Tu, University of California, Los Angeles
  • Book: Electronic Thin-Film Reliability
  • Online publication: 05 July 2014
  • Chapter DOI: https://doi.org/10.1017/CBO9780511777691.014
Available formats
×