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  3. Electronic Thin-Film Reliability
  • Cited by 15
Publisher:
Cambridge University Press
Online publication date:
July 2014
Print publication year:
2010
Online ISBN:
9780511777691
DOI:
https://doi.org/10.1017/CBO9780511777691
Subjects:
Engineering, Electronic, Optoelectronic Devices, and Nanotechnology, Materials Science
Information

Book description

Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

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