Recent years have witnessed an explosion of interest in the application of polymers as the substrates for various electronic and display devices. The advantages of polymers are their mechanical flexibility, light weight, enhanced durability, roll-to-roll fabrication and low cost compared with rigid materials (such as silicon and glass). Hybrid polymers have drawn great attention because they offer the opportunity to prepare high-performance multifunctional advanced materials through the combination of properties of organic and inorganic segments. Recently, a new approach to construction of nanohybrid materials based on polyhedral oligomeric silsesquioxne (POSS) as an inorganic moiety has attracted a lot of interest. Double-decker-shaped silsesquioxane (DDSQ) is a new family of silsesquioxane consisting of nanometer-sized Si-O-Si cage structure functionalized with a wide variety of organic groups. DDSQ-based hybrid polymer (Double-decker-shaped polysilsesquioxane, DDPSQ) possesses many fascinating properties such as high thermal stability, good mechanical properties, low dielectric constant, excellent transparency, excellent flexibility and so on. Due to these fascinating properties, DDPSQ can be used as a potential candidate substrate for various flexible electronic devices. For such applications drawing of conductive metal (Au, Cu, Ag) patterns on a DDPSQ substrate is required. Herein, we have described fabrication of Ag microwiring with submicron resolution on a DDPSQ film by laser direct writing. The line width of the Ag-wiring fabricated by this laser direct-write maskless technique can be controlled flexibly by changing the objective lens magnification and the focusing point. With an objective lens magnification 100x, Ag microwiring with a line width of about 5 μm has been achieved. The Ag-wiring shows an excellent adhesion to DDPSQ surface as evaluated by Schotch tape test. The resistivity of the Ag-wiring is determined to be 4.3 × 10-6 Ω cm ,which is comparable that of bulk Ag (1.6 × 10-6 Ω cm).