30 results
Characterization of Cu-Al alloy/SiO2 interface microstructure
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 615 / 2000
- Published online by Cambridge University Press:
- 14 March 2011, G7.5.1
- Print publication:
- 2000
-
- Article
- Export citation
X-ray Photoelectron Spectroscopic Studies of Cu-AI alloy/SiO2 Interfaces
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 564 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 347
- Print publication:
- 1999
-
- Article
- Export citation
Optical Properties of a Polyimide for Waveguide Applications in On-Chip Interconnects
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 597 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 125
- Print publication:
- 1999
-
- Article
- Export citation
Homogenization of the Bilayers of Cu-Al Alloy and Pure Copper to Produce CU-0.3 at.% Al Alloy Films
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 514 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 281
- Print publication:
- 1998
-
- Article
- Export citation
Investigation of the Homovalent Impurity in Aluminum to Form Alloys With Enhanced Interconnect Reliability
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 514 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 113
- Print publication:
- 1998
-
- Article
- Export citation
Chemical-Mechanical Planarization of the Polymer Interlayer Dielectrics
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 511 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 277
- Print publication:
- 1998
-
- Article
- Export citation
Capacitance-Voltage, Current Voltage, and Thermal Stability of Copper Alloyed With Aluminum or Magnesium
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 514 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 263
- Print publication:
- 1998
-
- Article
- Export citation
Modeling of Temperature Increase Due to Joule Heating During Electromigration Measurements
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 427 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 113
- Print publication:
- 1996
-
- Article
- Export citation
Chemical-Mechanical Polishing of Copper in Glycerol Based Slurries
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 427 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 237
- Print publication:
- 1996
-
- Article
- Export citation
Oxidation Resistant Dilute Copper (Boron) Alloy Films Prepared by DC-Magnetron Cosputtering
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 427 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 193
- Print publication:
- 1996
-
- Article
- Export citation
Oxidation Resistant Dilute Copper (Boron) Alloy Films Prepared by DC-Magnetron Cosputtering
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 428 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 17
- Print publication:
- 1996
-
- Article
- Export citation
Reactive Ion Etching of the fluorinated polyimide film
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 427 / 1996
- Published online by Cambridge University Press:
- 15 February 2011, 455
- Print publication:
- 1996
-
- Article
- Export citation
Use of Advantageous Impurity Effects in Metallization
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 405 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 485
- Print publication:
- 1995
-
- Article
- Export citation
Investigations of The Low Dielectric Constant Fluorinated Polyimide for Use as The Interlayer Dielectric in ULSI
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 381 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 31
- Print publication:
- 1995
-
- Article
- Export citation
Investigations Of The Chemical-Mechanical Polishing Of Polymer Films For ILD Applications
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 381 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 229
- Print publication:
- 1995
-
- Article
- Export citation
Surface and Interface Modification of Copper for Electronic Application
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 337 / 1994
- Published online by Cambridge University Press:
- 25 February 2011, 169
- Print publication:
- 1994
-
- Article
- Export citation
Chemical-Mechanical Polishing of Tungsten with Hologen-Based Slurries
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 337 / 1994
- Published online by Cambridge University Press:
- 25 February 2011, 145
- Print publication:
- 1994
-
- Article
- Export citation
Stability of Silicide Films Under Post-Annealing: a Dopant Effect
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 309 / 1993
- Published online by Cambridge University Press:
- 21 February 2011, 467
- Print publication:
- 1993
-
- Article
- Export citation
Applications of CoSi2 to VLSI and ULSI
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 320 / 1993
- Published online by Cambridge University Press:
- 03 September 2012, 3
- Print publication:
- 1993
-
- Article
- Export citation
Observation of Reduced Oxidation Rates for Plasmaassisted CVD Copper Films
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 309 / 1993
- Published online by Cambridge University Press:
- 21 February 2011, 455
- Print publication:
- 1993
-
- Article
- Export citation