5 results
Microstructure evolution and microimpact performance of Sn–Ag–Cu solder joints under thermal cycle test
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- Journal:
- Journal of Materials Research / Volume 25 / Issue 7 / July 2010
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1312-1320
- Print publication:
- July 2010
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The micro-impact fracture behavior of lead-free solder ball joints
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- Journal:
- Journal of Materials Research / Volume 23 / Issue 4 / April 2008
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1057-1063
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- April 2008
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Can the Sonic Radius in ADAF Be Large?
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- Journal:
- Symposium - International Astronomical Union / Volume 194 / 1999
- Published online by Cambridge University Press:
- 25 May 2016, pp. 332-333
- Print publication:
- 1999
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Microstructure of YBCO/Co-PBCO/YBCO edge Josephson junctions
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- Journal:
- Microscopy and Microanalysis / Volume 4 / Issue S2 / July 1998
- Published online by Cambridge University Press:
- 02 July 2020, pp. 672-673
- Print publication:
- July 1998
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Transmission Electron Microscopy Microstructure Characterization of YBCO/SrRuO3/YBCO Josephson Junctions
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- Journal:
- Microscopy and Microanalysis / Volume 3 / Issue 2 / March 1997
- Published online by Cambridge University Press:
- 31 January 2003, pp. 108-120
- Print publication:
- March 1997
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