Symposium F – Low-Dielectric Constant Materials--Synthesis and Applications in Micro.
Research Article
Metal-Parylene Interconnection Systems
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- 15 February 2011, 205
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Integration Of BPDA-PDA Polyimide With Two Levels Of Al(Cu) Interconnects
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- 15 February 2011, 217
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Investigations Of The Chemical-Mechanical Polishing Of Polymer Films For ILD Applications
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- 15 February 2011, 229
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Fluorinated SiO2 Films For Interlayer Dielectrics In Quarter-Micron Ulsi Multilevel Interconnections
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- 15 February 2011, 239
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Preparation And Properties Of Fluorinated Amorphous Carbon Thin Films By Plasma Enhanced Chemical Vapor Deposition
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- 15 February 2011, 249
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Material Characterization Of Methyl Siloxane Sogs
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- 15 February 2011, 255
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Preparation Of Low-Density Xerogels At Ambient Pressure For Low K Dielectrics
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- 15 February 2011, 261
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Silica Aerogel: An Intrinsically Low Dielectric Constant Material
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- 15 February 2011, 267
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Evaluation Of Amorphous Diamond-Like Carbon And Boron Nitride Films As Low Permittivity Dielectrics
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- 15 February 2011, 273
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Modification Effects in Argon Plasma Treated S1O2 Spin-On Glass
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- 15 February 2011, 279
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