Hostname: page-component-848d4c4894-2xdlg Total loading time: 0 Render date: 2024-06-21T06:31:54.710Z Has data issue: false hasContentIssue false
  • English
  • Français

Precipitate phase transformation behavior, microstructure, and properties of Cu–Cr–Co–Si alloy

Published online by Cambridge University Press:  10 February 2020

Xinglong Sun ,
Jinchuan Jie ,
Tongmin Wang  and
Tingju Li
Xinglong Sun
Affiliation:
Key Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Jinchuan Jie*
Affiliation:
Key Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Tongmin Wang
Affiliation:
Key Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Tingju Li
Affiliation:
Key Laboratory of Solidification Control and Digital Preparation Technology (Liaoning Province), School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
*
a)Address all correspondence to this author. e-mail: jiejc@dlut.edu.cn
Get access

Abstract

In this study, precipitate phase transformation behavior, microstructure, and properties of the Cu–1Cr–1Co–0.4Si (wt%) alloy were investigated. Precipitate phase transformation kinetic equations of the alloy under room temperature rolling (RTR) 90% deformation and aging at different temperatures (440–520 °C) were established. The alloy yielded excellent mechanical and electrical properties under RTR 90% deformation and aging at 440 °C for 1 h, and the corresponding hardness, yield strength (YS), ultimate tensile strength (UTS), elongation, and electrical conductivity were 181.6 HV, 573.6 MPa, 653.7 MPa, 7.3%, and 51.6% International Annealed Copper Standard, respectively. The precipitate phase transformation behavior determined the size and volume fraction of the precipitate phase fv, which played a key role in improving the YS. Impurity scattering caused by surplus Si atoms was mainly responsible for decreasing the electrical conductivity. Therefore, these results can provide a reliable theoretical guidance to prepare Cu–Cr–based alloys with high strength and high electrical conductivity.

Keywords

Cu–1Cr–1Co–0.4Si alloyprecipitate phase transformation behaviormicrostructureyield strengthelectrical conductivity
Type
Article
Information
Journal of Materials Research , Volume 35 , Issue 6 , 30 March 2020 , pp. 623 - 632
Copyright
Copyright © Materials Research Society 2020

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Choi, J.H.: Aging behavior and precipitate analysis of copper-rich Cu–Fe–Mn–P alloy. Mater. Sci. Eng., A 550, 183–190 (2012).CrossRefGoogle Scholar
Suzuki, S., Shibutani, N., Mimura, K., Isshiki, M., and Waseda, Y.: Improvement in strength and electrical conductivity of Cu–Ni–Si alloys by aging and cold rolling. J. Alloys Compd. 417, 116–120 (2006).CrossRefGoogle Scholar
Wang, W., Kang, H.J., Chen, Z.N., Chen, Z.J., Zou, C.L., Li, R.G., Yin, G.M., and Wang, T.M.: Effects of Cr and Zr additions on microstructure and properties of Cu–Ni–Si alloys. Mater. Sci. Eng., A 673, 378–390 (2016).CrossRefGoogle Scholar
Batra, I.S., Dey, G.K., Kulkarni, U.D., and Banerjee, S.: Microstructure and properties of a Cu–Cr–Zr alloy. J. Nucl. Mater. 299, 91–100 (2001).CrossRefGoogle Scholar
Zhao, Z.Q., Xiao, Z., Li, Z., Ma, M.Z., and Dai, J.: Effect of magnesium on microstructure and properties of Cu–Cr alloy. J. Alloys Compd. 752, 191–197 (2018).CrossRefGoogle Scholar
Guo, X.L., Xiao, Z., Qiu, W.T., Li, Z., Zhao, Z.Q., Wang, X., and Jiang, Y.B.: Microstructure and properties of Cu–Cr–Nb alloy with high strength, high electrical conductivity and good softening resistance performance at elevated temperature. Mater. Sci. Eng., A 749, 281–290 (2019).CrossRefGoogle Scholar
Pang, Y., Xia, C.D., Wang, M.P., Li, Z., Xiao, Z., Wei, H.G., Sheng, X.F., Jia, Y.L., and Chen, C.: Effects of Zr and (Ni, Si) additions on properties and microstructure of Cu–Cr alloy. J. Alloys Compd. 582, 786–792 (2014).CrossRefGoogle Scholar
Luo, C.P., Dahmen, U., and Westmacott, K.H.: Morphology and crystallography of Cr precipitates in a Cu–0.33 wt% Cr alloy. Acta Metall. Mater. 42, 1923–1932 (1994).CrossRefGoogle Scholar
Wei, K.X., Wei, W., Wang, F., Du, Q.B., Alexandrov, I.V., and Hu, J.: Microstructure, mechanical properties and electrical conductivity of industrial Cu–0.5%Cr alloy processed by severe plastic deformation. Mater. Sci. Eng., A 528, 1478 (2011).CrossRefGoogle Scholar
Peng, L.J., Xie, H.F., Huang, G.J., Xu, G.L., Yin, X.Q., Feng, X., Mi, X.J., and Yang, Z.: The phase transformation and strengthening of a Cu–0.71 wt% Cr alloy. J. Alloys Compd. 708, 1096–1102 (2017).CrossRefGoogle Scholar
Yuan, Y., Li, Z., Xiao, Z., Zhao, Z.Q., and Yang, Z.Q.: Microstructure evolution and properties of Cu–Cr alloy during continuous extrusion process. J. Alloys Compd. 703, 454–460 (2017).CrossRefGoogle Scholar
Fu, H.D., Xu, S., Li, W., Xie, J.X., Zhao, H.B., and Pan, Z.J.: Effect of rolling and aging processes on microstructure and properties of Cu–Cr–Zr alloy. Mater. Sci. Eng., A 700, 107–115 (2017).CrossRefGoogle Scholar
Abib, K., Azzeddine, H., Tirsatine, K., Baudin, T., Helbert, A.L., Brisset, F., Alili, B., and Bradai, D.: Thermal stability of Cu–Cr–Zr alloy processed by equal-channel angular pressing. Mater. Charact. 118, 527–534 (2016).CrossRefGoogle Scholar
Jia, S.G., Zheng, M.S., Liu, P., Ren, F.Z., Tian, B.H., Zhou, G.S., and Lou, H.F.: Aging properties studies in a Cu–Ag–Cr alloy. Mater. Sci. Eng., A 419, 8–11 (2006).CrossRefGoogle Scholar
Sheng, X., Fu, H.D., Wang, Y.T., and Xie, J.X.: Effect of Ag addition on the microstructure and mechanical properties of Cu–Cr alloy. Mater. Sci. Eng., A 726, 208–214 (2018).Google Scholar
Fernee, H., Nairn, J., and Atrens, A.: Precipitation hardening of Cu–Fe–Cr alloys part II microstructural characterization. J. Mater. Sci. 36, 2721–2741 (2001).CrossRefGoogle Scholar
Markandeya, R., Nagarjuna, S., and Sarma, D.S.: Precipitation hardening of Cu–Ti–Cr alloys. Mater. Sci. Eng., A 371, 291–305 (2004).CrossRefGoogle Scholar
Zhang, P.C., Jie, J.C., Gao, Y., Li, H., Wang, T.M., and Li, T.J.: Influence of cold deformation and Ti element on the microstructure and properties of Cu–Cr system alloys. J. Mater. Res. 30, 2073–2080 (2015).CrossRefGoogle Scholar
Sun, X.L., Jie, J.C., Wang, P.F., Qin, B.L., Ma, X.D., Wang, T.M., and Li, T.J.: Effects of Co and Si additions and cryogenic rolling on structure and properties of Cu–Cr alloys. Mater. Sci. Eng., A 740–741, 165–173 (2019).CrossRefGoogle Scholar
Xia, C.D., Jia, Y.L., Wan, Z., Ke, Z., Dong, Q.Y., Xu, G.Y., and Wang, M.P.: Study of deformation and aging behaviors of a hot rolled-quenched Cu–Cr–Zr–Mg–Si alloy during thermomechanical treatments. Mater. Des. 39, 404–409 (2012).CrossRefGoogle Scholar
Zhou, Z.M., Gao, J., Li, F., Zhang, Y.K., Wang, Y.P., and Kolbe, M.: On the metastable miscibility gap in liquid Cu–Cr alloys. J. Mater. Sci. 44, 3793–3799 (2009).CrossRefGoogle Scholar
Batra, I.S., Dey, G.K., Kulkarni, U.D., and Banerjee, S.: Precipitation in a Cu–Cr–Zr alloy. Mater. Sci. Eng., A 356, 32–36 (2003).CrossRefGoogle Scholar
Aikin, R.M. and Christodoulou, L.: The role of equiaxed particles on the yield stress of composites. Scr. Metall. Mater. 2, 9–14 (1991).CrossRefGoogle Scholar
Staker, M.R. and Holt, D.L.: The dislocation cell size and dislocation density in copper deformed at temperatures between 25 and 700 °C. Acta Metall. 20, 569–579 (1972).CrossRefGoogle Scholar
Gladman, T.: Precipitation hardening in metals. Met. Sci. J. 15, 30–36 (1999).Google Scholar
Davis, J.R.: Copper and Copper Alloys (ASM International, 2001).Google Scholar
Roy, G.L., Embury, J.D., and Edwards, G.: A model of ductile fracture based on the nucleation and growth of voids. Acta Metall. 29, 1509–1522 (1981).CrossRefGoogle Scholar
Qu, L., Wang, E.G., Han, K., Zuo, X.W., Zhang, L., Jia, P., and He, J.C.: Studies of electrical resistivity of an annealed Cu–Fe composite. J. Appl. Phys. 113, 11–22 (2013).CrossRefGoogle Scholar
Tian, L., Anderson, I., Riedemann, T., and Russell, A.: Modeling the electrical resistivity of deformation processed metal-metal composites. Acta Metall. 77, 151–161 (2014).Google Scholar
Martienssen, W. and Warlimont, H.: Springer Handbook of Condensed Matter and Materials Data (Springer, Berlin Heidelberg, Germany, 2005); p. 233.CrossRefGoogle Scholar
Andrews, P.V., West, M.B., and Robeson, C.R.: The effect of grain boundaries on the electrical resistivity of polycrystalline copper and aluminium. Philos. Mag. 19, 887–898 (1969).CrossRefGoogle Scholar
Mccrea, J.L., Aust, K.T., Palumbo, G., and Erb, U.: Electrical resistivity as a characterization tool for nanocrystalline metals. Mater. Res. Soc. Symp. Proc. 581, 461 (1999).CrossRefGoogle Scholar
Kniseley, R.N.: Quantitative microscopy. Microchem. J. 15, 150 (1970).CrossRefGoogle Scholar
Mclachlan, D.S., Blaszkiewicz, M., and Newnham, R.E.: Electrical resistivity of composites. J. Am. Ceram. Soc. 73, 2187–2203 (2010).CrossRefGoogle Scholar
Ghosh, G., Miyake, J., and Fine, M.E.: The systems-based design of high-strength, high-conductivity alloys. JOM 49, 56–60 (1997).CrossRefGoogle Scholar
Brown, R.A.: Electrical resistivity of dislocations in metals. J. Phys. F: Met. Phys. 7, 1283–1295 (1977).CrossRefGoogle Scholar
Botcharova, E., Freudenberger, J., and Schultz, L.: Mechanical and electrical properties of mechanically alloyed nanocrystalline Cu–Nb alloys. Acta Mater. 54, 3333–3341 (2006).CrossRefGoogle Scholar
Su, J.H., Liu, P., Li, H.J., Ren, F.Z., and Dong, Q.M.: Phase transformation in Cu–Cr–Zr–Mg alloy. Mater. Lett. 61, 4963–4966 (2007).CrossRefGoogle Scholar
Yi, Z., Volinsky, A.A., Hai, T.T., Zhe, C., Ping, L., Tian, B.H., and Yong, L.: Aging behavior and precipitates analysis of the Cu–Cr–Zr–Ce alloy. Mater. Sci. Eng., A 650, 248–253 (2016).Google Scholar
Porter, D.A., Easterling, K.E., and Sherif, M.Y.: Phase Transformations in Metals and Alloys, 3rd ed. (CRC Press, Boca Raton, America, 2014); p. 287.Google Scholar
Jana, S., Devaraj, A., Kovarik, L., Arey, B., Sweet, L., Varga, T., Lavender, C., and Joshi, V.: Kinetics of cellular transformation and competing precipitation mechanisms during sub-eutectoid annealing of U10Mo alloys. J. Alloys Compd. 723, 757–771 (2017).CrossRefGoogle Scholar
Semboshi, S., Amano, S., Fu, J., Iwase, A., and Takasugi, T.: Kinetics and equilibrium of age-induced precipitation in Cu–4 at.% Ti binary alloy. Metall. Mater. Trans. A 48, 1501–1511 (2017).CrossRefGoogle Scholar