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Measurement of impact toughness of eutectic SnPb and SnAgCu solder joints in ball grid array by mini-impact tester

Published online by Cambridge University Press:  31 January 2011

Yuhuan Xu ,
Shengquan Ou ,
K.N. Tu ,
Kejun Zeng  and
Rajiv Dunne
Yuhuan Xu
Affiliation:
Department of Materials Science & Engineering, University of California at Los Angeles, Los Angels, California 90095
Shengquan Ou
Affiliation:
Department of Materials Science & Engineering, University of California at Los Angeles, Los Angels, California 90095
K.N. Tu
Affiliation:
Department of Materials Science & Engineering, University of California at Los Angeles, Los Angels, California 90095
Kejun Zeng*
Affiliation:
Texas Instruments, Inc., Dallas, Texas 75265
Rajiv Dunne
Affiliation:
Texas Instruments, Inc., Dallas, Texas 75265
*
a)Address all correspondence to this author. e-mail: k-zeng2@ti.com
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Abstract

The most frequent cause of failure for wireless, handheld, and portable consumer electronic products is an accidental drop to the ground. The impact may cause interfacial fracture of ball-grid-array solder joints. Existing metrology, such as ball shear and ball pull tests, cannot characterize the impact-induced high speed fracture failure. In this study, a mini-impact tester was utilized to measure the impact toughness and to characterize the impact reliability of both eutectic SnPb and SnAgCu solder joints. The annealing effect at 150 °C on the impact toughness was investigated, and the fractured surfaces were examined. The impact toughness of SnAgCu solder joints with the plating of electroless Ni/immersion Au (ENIG) became worse after annealing, decreasing from 10 or 11 mJ to 7 mJ. On the other hand, an improvement of the impact toughness of eutectic SnPb solder joints with ENIG was recorded after annealing, increasing from 6 or 10 to 15 mJ. Annealing has softened the bulk SnPb solder so that more plastic deformation can occur to absorb the impact energy.

Keywords

SolderingPackagingStrength
Type
Articles
Information
Journal of Materials Research , Volume 23 , Issue 5 , May 2008 , pp. 1482 - 1487
Copyright
Copyright © Materials Research Society 2008

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References

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