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Microstructural evolution and bonding mechanisms of the brazed Ti/ZrO2 joint using an Ag68.8Cu26.7Ti4.5 interlayer at 900 °C

Published online by Cambridge University Press:  28 February 2014

Shen-Hung Wei  and
Chien-Cheng Lin
Shen-Hung Wei
Affiliation:
Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
Chien-Cheng Lin*
Affiliation:
Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 300, Taiwan
*
a)Address all correspondence to this author. e-mail: chienlin@faculty.nctu.edu.tw
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Abstract

In this study, 3 mol% Y2O3-stabilized zirconia (3Y–ZrO2) and commercially pure titanium (cp-Ti) joints were fabricated with an Ag68.8Cu26.7Ti4.5 interlayer (Ticusil) at 900 °C for various brazing periods. After brazing at 900 °C/0.1 h, Ti2Cu, TiCu, Ti3Cu4, and TiCu4 layers were present at the Ti/Ticusil interface, while TiCu and TiO layers were observed at the Ticusil/3Y–ZrO2 interface. In the residual interlayer, clumpy TiCu4 was formed along with the Ag solid phase. After brazing at 900 °C/1 h, Ti3Cu3O and Ti2O layers were formed at the interlayer/ZrO2 interface, while Cu2O was precipitated in the residual interlayer with $\left[ {111} \right]_{{\rm{Cu}}_{\rm{2}} {\rm{O}}} //\left[ {111} \right]_{{\rm{Ag}}}$ and $\left( {20\bar 2} \right)_{{\rm{Cu}}_{\rm{2}} {\rm{O}}} //\left( {20\bar 2} \right){}_{{\rm{Ag}}}$. After brazing at 900 °C/6 h, a two-phase (α-Ti + Ti2Cu) region was observed on the Ti side with $\left[ {2\bar 1\bar 10} \right]_{{\rm{\alpha - Ti}}} //\left[ {100} \right]_{{\rm{Ti}}_{\rm{2}} {\rm{Cu}}}$ and $\left( {0002} \right)_{{\rm{\alpha - Ti}}} //\left( {0\bar 13} \right)_{{\rm{Ti}}_{\rm{2}} {\rm{Cu}}}$, while the TiCu layer grew at the expense of Ti3Cu4 and TiCu4. The bonding mechanisms and diffusion paths were explored with the aid of Ag–Cu–Ti and Ti–Cu–O ternary phase diagrams.

Type
Articles
Information
Journal of Materials Research , Volume 29 , Issue 5 , 14 March 2014 , pp. 684 - 694
Copyright
Copyright © Materials Research Society 2014 

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