Hostname: page-component-5d59c44645-lfgmx Total loading time: 0 Render date: 2024-02-26T01:23:20.367Z Has data issue: false hasContentIssue false

Effects of current densities on creep behaviors of Sn–3.0Ag–0.5Cu solder joint

Published online by Cambridge University Press:  11 November 2014

Limin Ma*
Affiliation:
College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
Yong Zuo
Affiliation:
College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
Fu Guo*
Affiliation:
College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
Yutian Shu
Affiliation:
College of Materials Science and Engineering, Beijing University of Technology, Beijing 100124, China
*
a)Address all correspondence to this author. e-mail: guofu@bjut.edu.cn
Get access

Abstract

Creep and electromigration (EM) have been two reliability concerns in microelectronic devices for a long time. The related failure mechanisms have been widely investigated and comprehended individually. However, there is a lack of attention with regard to the interaction(s) between current density and creep, the coupling effect of which is more analogous to the real service conditions of lead-free solder joint. In this study, a series of experiments were carried out on the simple shear lap joint to investigate the effects of current density magnitude on the creep behavior of solder joints. The results indicated that dislocation creep was the main failure mechanism for low current density sample. For high current density sample, the failure mechanism was mainly dominated by copper atom migrating process which led the joint experience a higher risk of brittle fracture failure.

Type
Articles
Copyright
Copyright © Materials Research Society 2014 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Lee, K.O., Morris, J.W., and Hua, F.: Mechanisms of creep deformation in pure Sn solder joints. J. Electron. Mater. 42(3), 516 (2013).CrossRefGoogle Scholar
Chen, C. and Liang, S.W.: Electromigration issues in lead-free solder joints. J. Mater. Sci.: Mater. Electron. 18(1–3), 259 (2006).Google Scholar
Lee, A., Ho, C.E., and Subramanian, K.N.: Electromigration induced microstructure and morphological changes in eutectic SnPb solder joints. J. Mater. Res. 22(11), 3265 (2011).CrossRefGoogle Scholar
Lee, K., Kim, K-S., Tsukada, Y., Suganuma, K., Yamanaka, K., Kuritani, S., and Ueshima, M.: Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn–Ag–Cu/Cu ball joints. J. Mater. Res. 26(03), 467 (2011).CrossRefGoogle Scholar
Wang, Y., Lu, K.H., Gupta, V., Stiborek, L., Shirley, D., Chae, S-H., Im, J., and Ho, P.S.: Effects of Sn grain structure on the electromigration of Sn–Ag solder joints. J. Mater. Res. 27(08), 1131 (2012).CrossRefGoogle Scholar
Su, F., Mao, R., Wang, X., Wang, G., and Pan, H.: Creep behaviour of Sn–3.8Ag–0.7Cu under the effect of electromigration: Experiments and modelling. Microelectron. Reliab. 51(5), 1020 (2011).CrossRefGoogle Scholar
Pharr, M., Zhao, K., Suo, Z., Ouyang, F-Y., and Liu, P.: Concurrent electromigration and creep in lead-free solder. J. Appl. Phys. 110(8), 083716 (2011).CrossRefGoogle Scholar
Kinney, C., Lee, T-K., Liu, K-C., and Morris, J.W.: The interaction between an imposed current and the creep of idealized Sn-Ag-Cu solder interconnects. J. Electron. Mater. 38(12), 2585 (2009).CrossRefGoogle Scholar
Kinney, C., Morris, J.W., Lee, T.K., Liu, K.C., Xue, J., and Towne, D.: The influence of an imposed current on the creep of Sn-Ag-Cu solder. J. Electron. Mater. 38(2), 221 (2009).CrossRefGoogle Scholar
Cadek, J.: Creep in Metallic Materials (Elsevier Science Publishing Company, New York, NY, 1988), pp. 221224.Google Scholar
Cuddalorepatta, G., Williams, M., and Dasgupta, A.: Viscoplastic creep response and microstructure of as-fabricated microscale Sn-3.0Ag-0.5Cu solder interconnects. J. Electron. Mater. 39(10), 2292 (2010).CrossRefGoogle Scholar
Ke, J.H., Chuang, H.Y., Shih, W.L., and Kao, C.R.: Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing. Acta Mater. 60(5), 2082 (2012).CrossRefGoogle Scholar
Nah, J.W., Ren, F., Paik, K.W., and Tu, K.N.: Effect of electromigration on mechanical shear behavior of flip chip solder joints. J. Mater. Res. 21(3), 698 (2006).CrossRefGoogle Scholar
Ren, F., Nah, J-W., Tu, K.N., Xiong, B., Xu, L., and Pang, J.H.L.: Electromigration induced ductile-to-brittle transition in lead-free solder joints. Appl. Phys. Lett. 89(14), 141914 (2006).CrossRefGoogle Scholar
Kinney, C., Morris, J.W., Lee, T-K., Liu, K-C., Xue, J., and Towne, D.: The influence of an imposed current on the creep of Sn-Ag-Cu solder. J. Electron. Mater. 38(2), 221 (2008).CrossRefGoogle Scholar
Zhao, G.F. and Yang, F.Q.: Effect of DC current on tensile creep of pure tin. Mater. Sci. Eng., A 591, 97 (2014).CrossRefGoogle Scholar
Liu, H.Y., Zhu, Q.S., Wang, Z.G., and Shang, J.K.: Stress relaxation behavior of Cu/Sn/Cu micro-connect after electrical current. Mater. Sci. Eng., A 528(3), 1467 (2011).CrossRefGoogle Scholar
Shao, S.S., Yang, F.Q., and Xuan, F.Z.: Effect of electromigration on diffusional creep in polycrystalline materials. Int. J. Appl. Electrom. 40(2), 165 (2012).Google Scholar
Ma, L., Zuo, Y., Liu, S., Guo, F., and Wang, X.: The failure models of Sn-based solder joints under coupling effects of electromigration and thermal cycling. J. Appl. Phys. 113(4), 044904 (2013).CrossRefGoogle Scholar
Lu, M., Shih, D-Y., Lauro, P., and Goldsmith, C.: Blech effect in Pb-free flip chip solder joint. Appl. Phys. Lett. 94(1), 011912 (2009).CrossRefGoogle Scholar
Wu, A.T., Gusak, A.M., Tu, K.N., and Kao, C.R.: Electromigration-induced grain rotation in anisotropic conducting beta tin. Appl. Phys. Lett. 86(24), 241902 (2005).CrossRefGoogle Scholar