31 results
Systematic Process Development for Optimization of Manufacturable Organic Solar Cells
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1390 / 2012
- Published online by Cambridge University Press:
- 23 March 2012, mrsf11-1390-h13-30
- Print publication:
- 2012
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Pb-Free Solder: New Materials Considerations for Microelectronics Processing
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- Journal:
- MRS Bulletin / Volume 32 / Issue 4 / April 2007
- Published online by Cambridge University Press:
- 31 January 2011, pp. 360-365
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- April 2007
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Delamination Trends of Underfill in Dca Assemblies
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- Journal:
- MRS Online Proceedings Library Archive / Volume 445 / 1996
- Published online by Cambridge University Press:
- 10 February 2011, 3
- Print publication:
- 1996
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Predicting and Comparing Electromigration Failure for Different Test Structures
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- Journal:
- MRS Online Proceedings Library Archive / Volume 338 / 1994
- Published online by Cambridge University Press:
- 22 February 2011, 435
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- 1994
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The Effect of Thermally Induced Stresses on Electromigration Lifetime Of Near-Bamboo Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 309 / 1993
- Published online by Cambridge University Press:
- 21 February 2011, 121
- Print publication:
- 1993
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Microstructure Based Modelling of Stress Migration and Electromigration Induced Failure Distributions
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- Journal:
- MRS Online Proceedings Library Archive / Volume 309 / 1993
- Published online by Cambridge University Press:
- 21 February 2011, 187
- Print publication:
- 1993
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Analysis of Thermal Stress Induced Void Growth During Thermal Cycling
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- Journal:
- MRS Online Proceedings Library Archive / Volume 308 / 1993
- Published online by Cambridge University Press:
- 15 February 2011, 291
- Print publication:
- 1993
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Material and Reliability Considerations for Anisotropically Conductive Adhesive Based Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 323 / 1993
- Published online by Cambridge University Press:
- 15 February 2011, 27
- Print publication:
- 1993
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Analysis of Thermal Stress Induced Void Growth During Thermal Cycling
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- Journal:
- MRS Online Proceedings Library Archive / Volume 309 / 1993
- Published online by Cambridge University Press:
- 21 February 2011, 223
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- 1993
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Microstructure Based Modelling of Stress Migration and Electromigration Induced Failure Distributions
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- Journal:
- MRS Online Proceedings Library Archive / Volume 308 / 1993
- Published online by Cambridge University Press:
- 15 February 2011, 255
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- 1993
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Mechanisms of Stress-Induced and Electromigration-Induced Damage in Passivated Narrow Metallizations on Rigid Substrates
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- Journal:
- MRS Bulletin / Volume 17 / Issue 7 / July 1992
- Published online by Cambridge University Press:
- 29 November 2013, pp. 61-69
- Print publication:
- July 1992
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Estimation of Thermal Stresses and Stress Concentrations in Confined Interconnect Lines of Rectangular Cross Section
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- Journal:
- MRS Online Proceedings Library Archive / Volume 265 / 1992
- Published online by Cambridge University Press:
- 15 February 2011, 39
- Print publication:
- 1992
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Stress Induced Void Nucleation in Narrow Aluminum Alloy Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 225 / 1991
- Published online by Cambridge University Press:
- 15 February 2011, 143
- Print publication:
- 1991
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Void Growth as a Function of Residual Stress Level in Thin, Narrow Aluminum Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 226 / 1991
- Published online by Cambridge University Press:
- 26 February 2011, 413
- Print publication:
- 1991
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Electromigration Damage by Current Induced Coalescence of Thermal Stress Voids
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- Journal:
- MRS Online Proceedings Library Archive / Volume 239 / 1991
- Published online by Cambridge University Press:
- 22 February 2011, 683
- Print publication:
- 1991
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Effects of High Temperature Process Steps on Void Size Distributions in Passivated, Narrow Aluminum Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 239 / 1991
- Published online by Cambridge University Press:
- 22 February 2011, 707
- Print publication:
- 1991
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The Effect of Line Geometry on Void Growth in Thin, Narrow Aluminum Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 225 / 1991
- Published online by Cambridge University Press:
- 15 February 2011, 149
- Print publication:
- 1991
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Thermal Stress Induced Void Formation in Narrow Passivated Cu Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 239 / 1991
- Published online by Cambridge University Press:
- 22 February 2011, 701
- Print publication:
- 1991
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Electromigration in Aluminum Based Interconnects of VLSI-Microcircuits, with and without Preceding Stress-Migration Damage
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- Journal:
- MRS Online Proceedings Library Archive / Volume 239 / 1991
- Published online by Cambridge University Press:
- 22 February 2011, 695
- Print publication:
- 1991
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Void Growth as a Function of Residual Stress Level in Thin, Narrow Aluminum Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 225 / 1991
- Published online by Cambridge University Press:
- 15 February 2011, 155
- Print publication:
- 1991
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