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This study of the indentation behavior of Si has revealed a complex process of mechanical deformation. As loading time increased, Si-XII and Si-III disappeared and only a-Si appeared in (111) samples. As loading time increased, crack was generated and residual stress was removed. At fast loading rate, the deformation behavior appears predominantly elastic. On the contrary, at slow loading rate, catastrophic plastic deformation occurred during loading stage.
We have observed crack behavior which occurred under spherical indentation in crystalline silicon. Method which was used in our research for cross-sectional observation exaggerated generation and propagation of cracks. Our method prepares to observe crack behavior. But it is not profit to observe to phase transformation
The mechanical properties of silicon crystals are important from the viewpoint of wafer and device fabrication processes. It is now widely recognized that silicon undergoes a series of phase transformations when subjected to high pressures, using conventional high pressure devices, such as diamond anvils or hydrostatic pressure cells, or under indentation. Scratching on a silicon surface in the various conditions introduces various kinds of mechanical damage and stressed states. Micro-Raman spectroscopy was used to observe the phase transition of single crystal silicon. Several different phases were observed depending on scratching speed and scratched locations.
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