This paper shows the potentialities of merging the MEMS and micromachining with SiGe technologies in order to speed up the performances of next generation of front end in term of flexibility, reconfigurability and adaptability. MEMS technologies are presented based on Benzo-Cyclo-Butene (BCB) materials and Bulk Acoustic Wave (BAW) materials. Special attention is paid to ensure a full compatibility between IC and MEMS. We have shown that very innovative functions could be considered by using this MEMSIC concept.