2 results
Cu CMP Edge Uniformity Improvement Studies for 32 nm Technology Node and Beyond
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1249 / 2010
- Published online by Cambridge University Press:
- 01 February 2011, 1249-E01-06
- Print publication:
- 2010
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- Article
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Extendibility Study of a PVD Cu Seed Process with Ar+ Rf-Plasma Enhanced Coverage for 45nm Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1079 / 2008
- Published online by Cambridge University Press:
- 01 February 2011, 1079-N03-04
- Print publication:
- 2008
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- Article
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