2 results
Current and Future Three-Dimensional LSI Integration Technology by “chip on chip”, “chip on wafer” and “wafer on wafer”
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 970 / 2006
- Published online by Cambridge University Press:
- 26 February 2011, 0970-Y03-03
- Print publication:
- 2006
-
- Article
- Export citation
Mcm Development Using Fine Pitch Ball Bump
-
- Journal:
- MRS Online Proceedings Library Archive / Volume 445 / 1996
- Published online by Cambridge University Press:
- 10 February 2011, 83
- Print publication:
- 1996
-
- Article
- Export citation