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Mcm Development Using Fine Pitch Ball Bump

Published online by Cambridge University Press:  10 February 2011

Akihiro Dohya ,
Ikushi Morisaki ,
Manabu Bonkohara  and
Hirofumi Nakamura
Akihiro Dohya
Affiliation:
NEC Corporation, Production Material Engineering Laboratory, 1753 Shimonumabe, Nakahara-ku, Kawasaki, Kanagawa, 211, Japan
Ikushi Morisaki
Affiliation:
NEC Corporation, Production Material Engineering Laboratory, 1753 Shimonumabe, Nakahara-ku, Kawasaki, Kanagawa, 211, Japan
Manabu Bonkohara
Affiliation:
NEC Corporation, Production Material Engineering Laboratory, 1753 Shimonumabe, Nakahara-ku, Kawasaki, Kanagawa, 211, Japan
Hirofumi Nakamura
Affiliation:
NEC Corporation, Production Material Engineering Laboratory, 1753 Shimonumabe, Nakahara-ku, Kawasaki, Kanagawa, 211, Japan
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Abstract

A fine-pitch ( less than 100 micro-meter pads pitch ) aluminum pad flip chip assembly technology for use with the built-up Printed Wiring Boards (PWB) has been developed and named “Lead-Less-Chip Assembly (LLC Assembly)” technology. Our newly developed technology consists of three points: Forming gold-ball-bumps on the aluminum pads of the bare LSI chip by a wire ball bonding method. Solder-coating on the copper pads of the built-up PWB using Micro Punching technology or the Super-Juffit technology. Flux-less solder bonding the bare chip onto the PWB with a nitrogen atmosphere.

A reliability evaluation performed on a single chip and multi chip modules assembled using this LLC Assembly technology with test chips and real C-MOS devices showed a high level of endurance. We have applied this technology to Multichip modules (MCMs) for Note Personal Computers and portable terminals.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 445: Electronic Packaging Materials Science IX , 1996 , 83
Copyright
Copyright © Materials Research Society 1997

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References

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