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Magnetic-field induced anisotropy in electromigration behavior of Sn–Ag–Cu solder interconnects
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- Journal:
- Journal of Materials Research / Volume 30 / Issue 8 / 28 April 2015
- Published online by Cambridge University Press:
- 13 April 2015, pp. 1065-1071
- Print publication:
- 28 April 2015
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- Article
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