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Magnetic-field induced anisotropy in electromigration behavior of Sn–Ag–Cu solder interconnects

Published online by Cambridge University Press:  13 April 2015

Jian-Qiang Chen ,
Jing-Dong Guo ,
Hui-Cai Ma ,
Kai-Lang Liu ,
Qing-sheng Zhu  and
Jian Ku Shang
Jian-Qiang Chen
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Jing-Dong Guo*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Hui-Cai Ma
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Kai-Lang Liu
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Qing-sheng Zhu
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
Jian Ku Shang*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China; and Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois 61801, USA
*
a)Address all correspondence to this author. e-mail: jdguo@imr.ac.cn; jkshang@imr.ac.cn
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Abstract

Sn–Ag–Cu solder interconnects were made by solidifying the solder balls in a magnetic field and subsequently tested for their electromigration behavior. The orientation of the tin grains was analyzed by electron backscattered diffraction. It was found that the c-axis of Sn grain tended to rotate away from the direction of the magnetic field during solidification, resulting in an enhanced electromigration resistance for the solder joint when the current was applied along the direction of the magnetic field, as evidenced by a smaller electromigration-induced polarity effect in the growth of the interfacial intermetallic compound. Such a reduced polarity-effect of electromigration is shown to agree well with the anisotropy in the diffusivity of the active diffusion species, Cu, in the tetragonal Sn. The difference of free energy change caused by the anisotropy in the magnetic susceptibility of the tetragonal Sn during solidification is suggested to be the main factor for this phenomenon.

Keywords

tinanisotropysolidificationmagnetic fieldelectromigrationintermetallic compounds
Type
Articles
Information
Journal of Materials Research , Volume 30 , Issue 8 , 28 April 2015 , pp. 1065 - 1071
Copyright
Copyright © Materials Research Society 2015 

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