57 results
The ASIBS Short Course: A unique strategy for increasing statistical competency of junior investigators in academic medicine
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- Journal of Clinical and Translational Science / Volume 1 / Issue 4 / August 2017
- Published online by Cambridge University Press:
- 22 November 2017, pp. 235-239
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D-5 Analysis of Shear Stress Distribution in Al (Cu) Interconnects Induced by Electromigration Based on Schmidt's Law and Studied by Synchrotron Polychromatic X-ray Microdiffraction
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- Powder Diffraction / Volume 23 / Issue 2 / June 2008
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- 20 May 2016, p. 179
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S167 In-Situ Study of Electromigration Induced Strain/Stress Evolution and Distribution in Sn-Cu Lead-Free Solder Joints Using Synchrotron White Beam X-ray Microdiffraction
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- Powder Diffraction / Volume 23 / Issue 2 / June 2008
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- 20 May 2016, p. 189
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Aluminum Alloy Formation and Impacts in Advanced Replacement Metal Gate Process
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- MRS Online Proceedings Library Archive / Volume 1372 / 2012
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- 31 January 2012, imrc-1372-s3-14
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- 2012
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In-situ early stage electromigration study in Al line using synchrotron polychromatic X-ray microdiffraction
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- MRS Online Proceedings Library Archive / Volume 1079 / 2008
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- 01 February 2011, 1079-N05-02
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- 2008
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Study on molecular genetic diversity of native duck breeds in China
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- World's Poultry Science Journal / Volume 62 / Issue 4 / December 2006
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- 02 February 2007, pp. 603-611
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- December 2006
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Synchrotron X-ray Micro-diffraction Analysis on Microstructure Evolution in Sn under Electromigration
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- MRS Online Proceedings Library Archive / Volume 863 / 2005
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- 01 February 2011, B9.10
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- 2005
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Morphology Change, Size Distribution, and Nano-sized Channels in Cu6Sn5 Intermetallic Compound Formation at the SnPb Solder and Copper Interface
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- MRS Online Proceedings Library Archive / Volume 863 / 2005
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- 01 February 2011, B10.3
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- 2005
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A Study of Impact Reliability of Lead-free BGA Balls on Au/Electrolytic Ni/Cu Bond Pad
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- MRS Online Proceedings Library Archive / Volume 863 / 2005
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- 01 February 2011, B10.5
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- 2005
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Effect of supersaturation of Cu on reaction and intermetallic compound formation between Sn–Cu solder and thin film metallization
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- Journal of Materials Research / Volume 18 / Issue 9 / September 2003
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- 31 January 2011, pp. 2109-2114
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- September 2003
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Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages
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- Journal of Materials Research / Volume 17 / Issue 11 / November 2002
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- 31 January 2011, pp. 2757-2760
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- November 2002
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Stress Relaxation of a Patterned Microstructure on a Diaphragm
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- Journal of Materials Research / Volume 17 / Issue 7 / July 2002
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- 31 January 2011, pp. 1795-1802
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- July 2002
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Interfacial Microstructure Evolution Between Eutectic SnAgCu Solder and Al/Ni(V)/Cu Thin Films
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- Journal of Materials Research / Volume 17 / Issue 7 / July 2002
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- 31 January 2011, pp. 1612-1621
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- July 2002
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Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu
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- Journal of Materials Research / Volume 17 / Issue 2 / February 2002
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- 31 January 2011, pp. 291-301
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- February 2002
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Wavelength-Invariant Resist Composed of Bimetallic Layers
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- MRS Online Proceedings Library Archive / Volume 745 / 2002
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- 11 February 2011, N3.8
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- 2002
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Effect of current crowding on contact failure in heavily doped n+- and p+-silicon-on-insulator
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- Journal of Materials Research / Volume 15 / Issue 11 / November 2000
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- 31 January 2011, pp. 2387-2392
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- November 2000
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Interfacial Morphology and Shear Deformation of Flip Chip Solder Joints
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- Journal of Materials Research / Volume 15 / Issue 8 / August 2000
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- 31 January 2011, pp. 1679-1687
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- August 2000
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Silicide formation in implanted channels and interfacial reactions of metal contacts under high current density
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- Journal of Materials Research / Volume 14 / Issue 12 / December 1999
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- 31 January 2011, pp. 4720-4726
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- December 1999
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High-temperature lead-free SnSb solders: Wetting reactions on Cu foils and phased-in Cu–Cr thin films
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- Journal of Materials Research / Volume 14 / Issue 10 / October 1999
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- 31 January 2011, pp. 3895-3900
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- October 1999
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Two- and Three-dimensional Arrays of Magnetic Microspheres
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- Journal of Materials Research / Volume 14 / Issue 4 / April 1999
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- 31 January 2011, pp. 1186-1189
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- April 1999
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