5 results
Influence of Triple Junction Structure on Cu Segregation in Al Thin Films
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- Journal:
- Microscopy and Microanalysis / Volume 5 / Issue S2 / August 1999
- Published online by Cambridge University Press:
- 02 July 2020, pp. 846-847
- Print publication:
- August 1999
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The Effect of Cluster Interactions on Electromigration Induced Stress Evolution in Confined Metal Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 391 / 1995
- Published online by Cambridge University Press:
- 15 February 2011, 197
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- 1995
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Detailed Study of Electromigration Induced Damage in Al and AlCuSi Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 338 / 1994
- Published online by Cambridge University Press:
- 22 February 2011, 373
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- 1994
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Observation and Modelling of Electromigration-Induced Void Growth In AI-Based Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 308 / 1993
- Published online by Cambridge University Press:
- 15 February 2011, 267
- Print publication:
- 1993
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Observation and Modelling of Electromigration-Induced Void growth in Al-Based Interconnects
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- Journal:
- MRS Online Proceedings Library Archive / Volume 309 / 1993
- Published online by Cambridge University Press:
- 21 February 2011, 199
- Print publication:
- 1993
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