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The Effect of Cluster Interactions on Electromigration Induced Stress Evolution in Confined Metal Lines

Published online by Cambridge University Press:  15 February 2011

D.D. Brown ,
J.E. Sanchez Jr. ,
P.R. Besser ,
M.A. Korhonen  and
C.-Y. Li
D.D. Brown
Affiliation:
Advanced Process Development, Advanced Micro Devices, 1 AMD Place, Sunnyvale, CA 94088 Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
J.E. Sanchez Jr.
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
P.R. Besser
Affiliation:
Advanced Process Development, Advanced Micro Devices, 1 AMD Place, Sunnyvale, CA 94088
M.A. Korhonen
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
C.-Y. Li
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY 14853
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Abstract

In near-bamboo interconnect lines used in advanced integrated circuits, electromigration flux divergences occur at the intersection between polycrystalline cluster segments (where grain boundaries offer a fast diffusion path), and bamboo segments (where there are no grain boundaries along the line length). For confined, passivated metal interconnects, these flux divergences are linked to the evolution of significant mechanical stresses in the metal. A quasisteady state stress distribution builds up relatively quickly in the cluster segments and remains unchanged until there is significant diffusion into the bamboo segments. The stress profile of a given cluster then becomes dependent on neighboring clusters as well as the diffusivity and flux in the separating bamboo segments. Previous analyses of electromigration failure in interconnect lines have focused on the distribution of cluster lengths and the stress build up in isolated cluster segments. In this paper, we show that the bamboo length distribution can strongly affect the interaction between clusters and the evolution of stresses in a near-bamboo interconnect during electromigration. We present simulation results, using a ratio of cluster to bamboo diffusivity Dc/Db=100, which show greater interactions and larger maximum stresses in cluster segments as the average bamboo segment length decreases and as the bamboo segment length distribution widens.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 391: Symposium T – Materials Reliability in Microelectronics V , 1995 , 197
Copyright
Copyright © Materials Research Society 1995

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