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Water use Efficiency in Immersion Wafer Rinsing

Published online by Cambridge University Press:  10 February 2011

Thomas S. Roche ,
Thomas W. Peterson  and
Eric Hansen
Thomas S. Roche
Affiliation:
Motorola MOS 12 Die Manufacturing, 1300 N. Alma School Rd. Chandler AZ
Thomas W. Peterson
Affiliation:
Department of Chemical and Environmental Engineering, The University of Arizona, Tucson AZ
Eric Hansen
Affiliation:
SCP Global Technologies, Boise ID
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Abstract

This work is an effort to determine if we can use less water effectively in rinse processes. We have run experiments to examine our current usage and to determine if we can use water more effectively.

This work will describe the experiments which have been done relating the amount of chemical remaining on the wafers to variables of the: rinse such as flow rate, wafer spacing and the cycling of the rinse valves. We will discuss the conclusions we have reached based on those experiments and the directions we will be taking to improve rinsing efficiency.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 477 , 1997 , 527
Copyright
Copyright © Materials Research Society 1997

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References

REFERENCES

1. Roche, T.S. and Peterson, T. W., Solid State Technology 39 (12) 78–87, 1996.Google Scholar
2. Lindquist, P.G., Walters, R.N., Throngard, J.O. and Rosato, J.J., Proceedings of the Materials Research Society, 1995 Google Scholar
3. Rosato, J.J., Walters, R.N., Hall, R.M., Lindquist, P.G., Spearow, R.G. and Helms, C.R. in Cleaning Technology in Semiconductor Device Manufacturing, edited by J., Ruzyllo and R.E., Novak (Electrochemical Society Proceedings Volume 94–7 Pennington N.J., 1994) pp 140–152Google Scholar
4. Tonti, A. in Cleaning Technology in Semiconductor Device Manufacturing., edited by J., Ruzyllo and R.E., Novak (Electrochemical Society Proceedings Volume 92–12 Pennington N.J. 1992) pp 41–47Google Scholar