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Thermal Expansion Model for Multiphase Electronic Packaging Materials

Published online by Cambridge University Press:  26 February 2011

Ronald E. Allred  and
William E. Warren
Ronald E. Allred
Affiliation:
TPL, Inc., 3754 Hawkins NE, Albuquerque, NM 87109
William E. Warren
Affiliation:
Sandia National Laboratories, P. 0. Box 5800, Albuquerque, NM 87185–5800
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Abstract

Control of thermal expansion is often necessary in the design and selection of electronic packages. In some instances, it is desirable to have a coefficient of thermal expansion intermediate between values readily attainable with single or two phase materials. The addition of a third phase in the form of fillers, whiskers, or fibers can be used to attain intermediate expansions. To help design the thermal expansion of multiphase materials for specific applications, a closed form model has been developed that accurately predicts the effective elastic properties of isotropic filled materials and transversely isotropic lamina. Properties of filled matrix materials are used as inputs to the lamina model to obtain the composite elastic properties as a function of the volume fraction of each phase. Hybrid composites with two or more fiber types are easily handled with this model. Results for glass, quartz, and Kevlar fibers with beta-eucryptite filled polymer matrices show good agreement with experimental results for X, Y, and Z thermal expansion coefficients.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 331
Copyright
Copyright © Materials Research Society 1991

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References

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