Hostname: page-component-76fb5796d-dfsvx Total loading time: 0 Render date: 2024-04-26T15:33:03.049Z Has data issue: false hasContentIssue false

Minimization of Interfacial Microroughness for 13–60 Å Ultrathin Gate Oxides

Published online by Cambridge University Press:  10 February 2011

J. Sapjeta
Affiliation:
Bell Laboratories Lucent Technologies Murray Hill, NJ 07974
T. Boone
Affiliation:
Bell Laboratories Lucent Technologies Murray Hill, NJ 07974
J. M. Rosamilia
Affiliation:
Bell Laboratories Lucent Technologies Murray Hill, NJ 07974
P. J. Silverman
Affiliation:
Bell Laboratories Lucent Technologies Murray Hill, NJ 07974
T. W. Sorsch
Affiliation:
Bell Laboratories Lucent Technologies Murray Hill, NJ 07974
G. Timp
Affiliation:
Bell Laboratories Lucent Technologies Murray Hill, NJ 07974
B. E. Weir
Affiliation:
Bell Laboratories Lucent Technologies Murray Hill, NJ 07974
Get access

Abstract

By using a combination of smooth epi substrates (0.7 Å rms roughness), in-situ UV/Cl2 processing, and rapid thermal oxidation, highly reliable ultrathin gate oxides were produced with ≤ 1.0 Å rms interface roughness.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Hanson, K. J., Sapjeta, J., and Higashi, G. S., in Proc. of the Symp.on Diagnostic Techniques for Semiconductor Materials, edited by Schroder, D. K., Benton, J. L., and Rai-Choudhury, P. (Pennington, NJ: The Electrochemical Society, 1994) pp. 355369.Google Scholar
2. Liu, Q., Spanos, L., Zhao, C., and Irene, E. A., J. Vac. Sci. Technol. A 13, 1977 (1995).CrossRefGoogle Scholar
3. Sze, S. M., VLSI Technology, 2nd ed. (McGraw-Hill, Inc., New York, 1988), pp. 631–2.Google Scholar
4. Higashi, G. S. and Chabal, Y. J., in Handbook of Semiconductor Wafer Cleaning Technology, edited by Kern, W. (Noyes Publications, Park Ridge, NJ, 1993), p. 488.Google Scholar
5. Ma, Y. and Green, M. L., Proc. 4th Int.Symp. on Cleaning Technology in Semiconductor Device Manufacturing, edited by Novak, R. E. and Ruzyllo, J. (Pennington, NJ: The Electrochemical Society, 1996) pp. 115125.Google Scholar
6. Schuegraf, K. F., King, C. C., and Hu, C., 1992 Symp. on VLSI Tech., p.18.Google Scholar
7. Momose, H. S. et al. , IEEE Trans. Electr. Dev. 43, 1233(1996).Google Scholar
8. Akiyama, K. et al. , Jpn. J. Appl. Phys. 34, Pt. 2, No. 2A, L153 (1995).CrossRefGoogle Scholar
9. Kimura, M., Mitsuhashi, J., and Koyama, H., J. Appl. Phys. 77, 1569 (1995).CrossRefGoogle Scholar
10. Meuris, M. et al. , Jpn. J. Appl. Phys. 31, Pt. 2, No. 11A, L15147 (1992).CrossRefGoogle Scholar