Skip to main content Accessibility help
×
Home
Hostname: page-component-5bf98f6d76-64tqw Total loading time: 0.394 Render date: 2021-04-20T16:50:54.768Z Has data issue: true Feature Flags: { "shouldUseShareProductTool": true, "shouldUseHypothesis": true, "isUnsiloEnabled": true, "metricsAbstractViews": false, "figures": false, "newCiteModal": false, "newCitedByModal": true }

Post Metal Etch Treatment for Submicron Applications

Published online by Cambridge University Press:  10 February 2011

Simon Gonzales
Affiliation:
New Technology Group, Motorola Inc., 2200 W. Broadway Rd., Mesa, Arizona 85202
Gordy Grivna
Affiliation:
New Technology Group, Motorola Inc., 2200 W. Broadway Rd., Mesa, Arizona 85202
Anda McAfee
Affiliation:
New Technology Group, Motorola Inc., 2200 W. Broadway Rd., Mesa, Arizona 85202
Get access

Abstract

Corrosion control and passivation of post metal etch structures are critical for submicron applications and overall yield performance. This study focused on 0.6 micron metal line spaces and the development of a process utilizing an integrated metal etch, photoresist strip and passivation tool. Data collected to characterize the corrosion/passivation mechanism included: veil and photoresist strip chemistries, passivation steps, time delays, subsurface material versus veil formation and electrical and defectivity yield. A post metal etch process was tested and integrated into a manufacturing environment that has provided minimal line loss, complete removal of etch veils, robust corrosion control and substantial reduction of intermetal shorts.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below.

References

1. Sakuma, K., Yagi, S., Imai, K., Japan J. Appl. Phys. 33, 617619 (1994).CrossRefGoogle Scholar
2. Clayton, F.R., Beeson, S.A., Solid State Technology, Jul. 1993, 9397.Google Scholar
3. Ishida, T., Fujiwara, N., Yoneda, M., Nakamoto, K., Horie, K., Japan J. Appl. Phys., 31, 20452048 (1992).CrossRefGoogle Scholar
4. Pai, P. and Chin, C.H., Microelectronic Manufacturing and Testing, Feb. 1990, 37–39.Google Scholar
5. Gabriel, C. and Wallach, R. in 9th Symp., Plasma Proc., (Electrochem. Soc. Proc., Pennington, NJ, 1992.).Google Scholar
6. Thornton, J., Gonzales, S. and Quijada, J. in 1995 Proceedings, (Institute of Environmental Sci. Proc., Mount Prospect, IL, 1995) pp. 414420.Google Scholar
7. Savas, S., Dutton, D., Woods, B., Guerra, R. and Hammond, M., Solid State Technology, Oct.1996, 123–128.Google Scholar
8. Gebara, G., Mautz, K and Wootton, P. in 10th Symp.. Plasma Etch, (Electrochem. Soc. Proc. 94–20, Pennington, NJ, 1994) pp. 421427.Google Scholar
9. Gonzales, S., Quijada, J. and Grivna, G. in Microelectronic Device & Multilevel Interconnect Tech. II, (SPIE Proceedings 2875, Bellingham, WA, 1996) pp. 301311.CrossRefGoogle Scholar
10. Gabriel, C. and Wallach, R. in Proc of the Symposia on Reliability of Semiconductor Devices / Interconnections and Laser Processes for Microelectronic Applications Proc., (Electrochem. Soc. Proc., Pennington, NJ, 1992).Google Scholar
11. Brown, T.L., Lemay, H.E., Jr., Chemistry - The Central Science, 3rd ed. (Prentice-Hall, Inc., Englewood Cliffs, NJ, 1985), pp. 351.Google Scholar

Full text views

Full text views reflects PDF downloads, PDFs sent to Google Drive, Dropbox and Kindle and HTML full text views.

Total number of HTML views: 0
Total number of PDF views: 17 *
View data table for this chart

* Views captured on Cambridge Core between September 2016 - 20th April 2021. This data will be updated every 24 hours.

Send article to Kindle

To send this article to your Kindle, first ensure no-reply@cambridge.org is added to your Approved Personal Document E-mail List under your Personal Document Settings on the Manage Your Content and Devices page of your Amazon account. Then enter the ‘name’ part of your Kindle email address below. Find out more about sending to your Kindle. Find out more about sending to your Kindle.

Note you can select to send to either the @free.kindle.com or @kindle.com variations. ‘@free.kindle.com’ emails are free but can only be sent to your device when it is connected to wi-fi. ‘@kindle.com’ emails can be delivered even when you are not connected to wi-fi, but note that service fees apply.

Find out more about the Kindle Personal Document Service.

Post Metal Etch Treatment for Submicron Applications
Available formats
×

Send article to Dropbox

To send this article to your Dropbox account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Dropbox.

Post Metal Etch Treatment for Submicron Applications
Available formats
×

Send article to Google Drive

To send this article to your Google Drive account, please select one or more formats and confirm that you agree to abide by our usage policies. If this is the first time you use this feature, you will be asked to authorise Cambridge Core to connect with your <service> account. Find out more about sending content to Google Drive.

Post Metal Etch Treatment for Submicron Applications
Available formats
×
×

Reply to: Submit a response


Your details


Conflicting interests

Do you have any conflicting interests? *