Hostname: page-component-84b7d79bbc-2l2gl Total loading time: 0 Render date: 2024-07-26T18:56:59.150Z Has data issue: false hasContentIssue false

The AC-Indentation Technique and its Application to Al and Al-Si Coatings

Published online by Cambridge University Press:  26 February 2011

T.W. Wu*
Affiliation:
IBM Research Division, Almaden Research Center, San Jose, CA 95120.
Get access

Abstract

An ac-microindentation technique, namely indenting with a small displacement modulation superimposed on an otherwise linear indenter motion, will be introduced. The basic principle and theory will also be illustrated by using a mechanical model to simulate the indenter behavior.

Other than being as capable as conventional indentation, the ac-technique acquires the unloading slope simultaneously and continuously with the penetration depth and applied load during an entire indentation process. With this extra information, the conversion between the total depth and plastic depth can be executed right after a single indentation, and in turn the hardness as well as. contact modulus depth profiles can be calculated. This is in contrast to the conventional indentation technique where a group of indentations associated with different maximum loads are required in order to achieve the same purpose. Furthermore, it also avoids the subjectivity in the selection of the fitting portions from the unloading stage of an indentation curve to extract the unloading slopes as well as the plastic penetration depths.

Another important advantage of using this ac-technique is the high sensitivity in detecting the indenter/surface contact. This advantage is very useful in the determination of the origins of penetration depths as well as in the investigation the evolution of the contact area, and both issues are very crucial in the microhardness calculations.

The strain rate effect on the hardness measurements of a 1 μm thick Al-2%Si coating has been demonstrated by using the ac-technique. As the indenter loading speed increases from 2.5 to 10 nm/sec, the measured hardness of the coating can be increased from ∼20% to ∼80% depending on the penetration depth, and the shallower the penetration depth the larger the increment is. However, the contact modulus depth profiles remain unchanged for all the indentation rates.

Type
Research Article
Copyright
Copyright © Materials Research Society 1991

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Pethica, J.B. and Oliver, W.C., Mat. Soc. Symp. Proc. 130, 13(1988).Google Scholar
2. Wu, T.W., Hwang, C., Lo, J. and Alexopoulos, P.S., THi Solid Films 166, 299(1988); IBM Research Report, RJ 6195 (60869),1988.Google Scholar
3. Doerner, M.F. and Nix, W.D., J. Mater. Res. 1, 601(1986).Google Scholar
4. Loubet, J.L., George, J. M., Marchesini, O. and Meille, G., J. Tribol. 106, 43(1984).Google Scholar
5. Loubet, J.L., George, J. M. and Meille, G., in e and Lawn, B.R. eds., Microindentation Technique in Material Sciences and Engineering, ASTM Spec. Tech. Publ. 889, 1986 (ASTM, Philadelphia, PA)Google Scholar
6. Hannula, S.-P., Stone, D. and Li, C.-Y., Mat. Soc. Symp. Proc. 40, 217(1985).Google Scholar
7. Wu, T.W., J. Mater. Res. 6, 407(1991).Google Scholar
8. Pethica, J.B., Hutchings, R. and Oliver, W.C., Philos. Mag. A 48, 593(1983).Google Scholar
9. Oliver, W.C., McHargue, C.J. and Zinkle, S.J., Thin Solid Films 153 185(1987).Google Scholar
10. Sneddon, I.N., Proc. Cam. Phil. Soc. 44, 29(1946).Google Scholar
11. Sneddon, I.N., Proc. Cam. Phil. Soc. 2R4, 429(1948).Google Scholar
12. Sneddon, I.N., Int. J. Engng. Sci. 3, 47(1965).Google Scholar
13. Wu, T.W., Moshref, M. and Alexopoulos, P. S., Thin Solid Films 187, 295(1990); IBM Research Report, RJ 6768 (1989).Google Scholar
14. Raman, V. and Berriche, R., Mat. Res. Soc. Symp. Proc. 188, 171(1990).Google Scholar