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Microstructure and degradation mechanisms of TaSiN diffusion barriers for Cu interconnects

Published online by Cambridge University Press:  05 September 2003

Hans-Jürgen Engelmann ,
René Hübner ,
Michael Hecker ,
Norbert Mattern ,
Christian Wenzel ,
Ehrenfried Zschech  and
Klaus Wetzig
Hans-Jürgen Engelmann
Affiliation:
AMD Saxony LLC & Co KG, D-01330 Dresden, Germany
René Hübner
Affiliation:
Leibniz Institute for Solid State and Materials Research, 01069 Dresden, Germany
Michael Hecker
Affiliation:
Leibniz Institute for Solid State and Materials Research, 01069 Dresden, Germany
Norbert Mattern
Affiliation:
Leibniz Institute for Solid State and Materials Research, 01069 Dresden, Germany
Christian Wenzel
Affiliation:
Dresden University of Technology, 01062 Dresden, Germany
Ehrenfried Zschech
Affiliation:
AMD Saxony LLC & Co KG, D-01330 Dresden, Germany
Klaus Wetzig
Affiliation:
Leibniz Institute for Solid State and Materials Research, 01069 Dresden, Germany
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Type
Invited Papers
Information
Microscopy and Microanalysis , Volume 9 , Issue S03 , September 2003 , pp. 248 - 249
Copyright
Copyright © Microscopy Society of America 2003

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