Polarity issues affecting III-V nitride semiconductors are reviewed with respect to their determination and control. A set of conditions crucial to the polarity control of GaN is provided for each of the following growth techniques; molecular beam epitaxy (MBE), pulsed laser deposition (PLD) and hydride vapor phase epitaxy (HVPE). Although GaN films might have been deposited by identical growth methods using the same buffer layer technologies, there is often a conflict between the resulting polarities achieved by different research groups. In this paper, we present the implications of the conditions used in each of the processes used for two-step metalorganic chemical vapor deposition (MOCVD), demonstrating systematic control of the polarity of GaN films on sapphire substrates. The potential for confusion in polarity control will be explained, taking into account the implications clarified in our studies. The correlation between the polarity and the growth conditions will be discussed in order to provide a mechanism for the determination and control of the crystal polarity during the growth of GaN films.

AlN single crystals were grown on AlN/SiC seeds by sublimation of AlN powder in TaC crucibles in a nitrogen atmosphere. The seeds were produced by metallorganic chemical vapor deposition (MOCVD) of AlN on SiC crystals. The influence of growth temperature, growth time and source-to-seed distance on the crystallinity and the crystal growth rate were investigated. Crystals were grown in an RF heated sublimation reactor at growth temperatures ranging from 1800-2000°C, at a pressure of 600 Torr, nitrogen flow-rate of 100 sccm and source-to-seed distances of 10 and 35 mm. At 1870°C and a source-to-seed distance of 35 mm, isolated crystals were observed with few instances of coalescence. At 1930°C, a source-to-seed distance of 10 mm and longer growth times (~30 hrs), crystal coalescence was achieved. Above 1930°C, the decomposition of SiC was evidently affecting the growth morphology and resulted in growth of polycrystalline AlN. After an initial nucleation period, the observed growth rates (10-30 µm/hr) were in close agreement with predictions of a growth model that assumed gas-phase diffusion controlled growth. Optical and electron microscope observations revealed step-flow growth, while X-ray diffraction results showed the single crystal nature of the grown material. Single crystalline AlN was grown over surface areas of 200-300 mm2 and was transparent and essentially colorless.

We used single crystals of GaN, obtained from high-pressure synthesis, as substrates for Metalorganics Vapor Phase Epitaxy growth of violet and UV laser diodes. The use of high-quality bulk GaN leads to the decrease of the dislocation density to the low level of 105 cm−2, i.e. two orders of magnitude better than typical for the Epitaxial Lateral Overgrowth laser structures fabricated on sapphire. The low density and homogeneous distribution of defects in our structures enables the realization of broad stripe laser diodes. We demonstrate that our laser diodes, having 15 μm wide stripes, are able to emit 1.3-1.9 W per facet (50% reflectivity) in 30 ns long pulses. This result, which is among the best ever reported for nitride lasers, opens the path for the development of a new generation of high power laser diodes.

We report on the investigation of GaN(0001)−1×1 using synchrotron radiation x-ray excited photoelectron spectra from the core levels Ga 3p and N 1s, as well as from the contaminants O 1s and C 1s. Measurements were done after outgassing (a) and during three surface treatment methods performed in sequence; (b) ammonia (NH3) flux anneals, (c) Ga deposition with sample held at room temperature followed by vacuum anneal, and (d) Ga deposition on a heated sample followed by Ga desorption during NH3 flux anneal. We have found that the initial NH3 flux anneals increased the amount of present N on the surface and enabled the formation of a well-ordered surface structure, according to the low energy electron diffraction (LEED) pattern. After treatment (b) and (d) the core level spectra of Ga 3p are much improved showing clearly distinct features indicative of increased Ga-N bonding. The Ga to N concentration ratio decreases during the surface treatments from 4.0 to 1.1, hence towards stoichiometry. The amounts of C (and O) present on the surface after outgassing corresponded to 1.1 (0.9) monolayers (ML) but reduced to 0.1 (0.1) ML after the final treatment (d). The Fermi level position in the band gap shifts down by 0.55 eV during the surface treatments, indicating a change of states present in the band gap. We have also found strong support that this Ga-polar sample is initially Ga-terminated.

Thick GaN layers as well as AlGaN/GaN and AlN/GaN heterostructures grown by metalorganic vapor phase epitaxy have been photoelectrochemically (PEC) etched in various dilute electrolytes, and bandgap-selective etching has been demonstrated in heterostructures. This result is a significant step forward in the fabrication of group III-nitride devices and one-dimensional photonic bandgap (PBG) structures in the deep UV. Based on initial results from thick GaN layers, a method was developed to achieve self-stopping selective etching of thin GaN layers in AlGaN/GaN and AlN/GaN heterostructures. Selective PEC etching requires the use of a suitable light source with photon energies larger than the bandgap of GaN, but smaller than that of AlGaN or AlN, thus enabling selective hole generation in the GaN layers to be etched. Additionally, it is imperative to use an electrolyte that supports PEC etching of GaN without chemically etching AlGaN or AlN.

Producing high purity aluminum nitride crystals by the sublimation-recondensation technique is difficult due to the inherently reactive crystal growth environment, normally at temperature in excess of 2100 °C. The durability of the furnace fixture materials (crucibles, retorts, etc.) at such a high temperature remains a critical problem. In the present study, the suitability of several refractory materials for AlN crystal growth is investigated, including tantalum carbide, niobium carbide, tungsten, graphite, and hot-pressed boron nitride. The thermal and chemical properties and performance of these materials in inert gas, as well as under AlN crystal growth conditions are discussed. TaC and NbC are the most stable crucible materials with very low elemental vapor pressures in the crystal growth system. Compared with refractory material coated graphite crucibles, HPBN crucible is better for AlN self-seeded growth, as crystals tend to nucleate in thin colorless platelets with low dislocation density.

We have studied experimentally the effect of ambient temperature on performance of the surface-passivated Al0.2Ga0.8N/GaN heterostructure field-effect transistors in the temperature range from 25°C to 250°C. The measured data have been compared with physics-based modeling of the GaN transistor characteristics under different ambient temperatures. The experimental data, showing about 33% degradation in the saturation current with a temperature increase from 25°C to 250°C, agrees well with the results of simulations performed using ISE DESSIS software. Obtained results and analytical extrapolations can be used for predicting device performance in changing environments, as well as for optimization of the device structure.

Monochromatic CL imaging, CL spectra, WDS spectra, and EDS spectra and imaging demonstrate that electron beam bombardment of LEO-GaN causes decrease of near band edge cathodoluminescence intensity that cannot be attributed to absorption in a growing carbon contamination layer. An alternative explanation is needed, such as generation of defects, or charge injection and buildup of internal electric fields, caused by electron beam bombardment.