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Substrate and temperature effects in lead zirconate titanate films produced by facing targets sputtering

Published online by Cambridge University Press:  31 January 2011

R.A. Roy
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, New York 10598
K.F. Etzold
Affiliation:
IBM Research Division, T. J. Watson Research Center, Yorktown Heights, New York 10598
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Abstract

The growth of ferroelectric lead zirconate titanate (PZT) films by rf-sputtering using a facing targets geometry is described. This study focuses on the influence of the substrate on PZT thin film composition, structure, and electrical properties. The deposition temperatures ranged from room temperature to 700 °C and the process gas was a mixture of argon and oxygen. Effects of deposition conditions and post-deposition annealing on film composition, microstructure, and properties were evaluated using Rutherford backscattering spectroscopy (RBS), x-ray diffraction, electron microscopy, and measurements of the permittivity and polarization. The microstructure, composition, and permittivity of the films were found to be strongly dependent on the substrate temperature and on the preparation history of the films.

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Articles
Copyright
Copyright © Materials Research Society 1992

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References

1.Shintani, Y., Sato, K., Sakamoto, M., Fukuda, H., and Tada, O., Jpn. J. Appl. Phys. 17, 573 (1978).CrossRefGoogle Scholar
2.Ishida, M., Tsuji, S., Kimura, K., Matsunami, H., and Tanaka, T., J. Cryst. Growth 45, 393 (1978).CrossRefGoogle Scholar
3.Matsui, Y., Okuyama, M., Fujita, N., and Hamakawa, Y., J. Appl. Phys. 52, 5107 (1981).CrossRefGoogle Scholar
4.Mansingh, A., Sreenivas, K., and Rao, T. S., in Proc. 6th Symp. Appl. Ferroelectricity (IEEE, New York, 1986), p. 576.Google Scholar
5.Adachi, H., Kawaguchi, T., Kitabatake, M., and Wasa, K., Jpn. J. Appl. Phys. 22 S22 (2), 11 (1983).CrossRefGoogle Scholar
6.Krupanidhi, S. B., Maffei, N., Sayer, M., and El-Assal, K., J. Appl. Phys. 54, 6601 (1983).CrossRefGoogle Scholar
7.Iijima, K., Tomita, Y., Takayama, R., and Ueda, I., J. Appl. Phys. 60, 361 (1986).CrossRefGoogle Scholar
8.Shohata, N., Matsubara, S., Miyasaka, Y., and Yonezawa, M., in Proc. 6th Symp. Appl. Ferroelectricity (IEEE, New York, 1986), p. 580.Google Scholar
9.Takayama, R. and Tomita, Y., J. Appl. Phys. 65, 1666 (1989).CrossRefGoogle Scholar
10.Okuyama, M., Seto, H., Kojima, M., Matsui, Y., and Hamakawa, H., Jpn. J. Appl. Phys. 21 (1), 225 (1982).CrossRefGoogle Scholar
11.Okuyama, M. and Hamakawa, Y., Ferroelectrics 63, 243 (1985).CrossRefGoogle Scholar
12.Sreenivas, K., Sayer, M., Baar, D. J., and Nishioka, M., Appl. Phys. Lett. 52, 709 (1988).CrossRefGoogle Scholar
13.Castellano, R. N. and Feinstein, L. G., J. Appl. Phys. 50, 4406 (1979).CrossRefGoogle Scholar
14.Nawathey, R., Vispute, R. D., Chaudhari, S. M., Kanetkar, S. M., and Ogale, S. B., Solid State Commun. 71, 9 (1989).CrossRefGoogle Scholar
15.Davis, G. M. and Gower, M. C., Appl. Phys. Lett. 55, 112 (1989).CrossRefGoogle Scholar
16.Li, X. X., Linker, G., Meyer, O., Nold, E., Orbst, B., Ratzel, F., Smithey, R., Strehrlau, B., Weschenfelder, F., and Geerk, J., Z. Phys. B 74, 13 (1989).CrossRefGoogle Scholar
17.Lee, W. Y., Salem, J., Lee, V., Reuttner, C. T., Gorman, G., Savoy, R., Deline, V., and Huang, T. C., Thin Solid Films 166, 181 (1988).CrossRefGoogle Scholar
18.Roy, R. A., Etzold, K. F., and Cuomo, J. J., in Ferroelectric Thin Films, edited by Myers, E. R. and Kingon, A. I. (Mater. Res. Soc. Symp. Proc. 200, Pittsburgh, PA, 1990), p. 77.Google Scholar
19.Etzold, K. F., Roy, R. A., Saenger, K. L., and Cuomo, J. J., in Ferroelectric Thin Films, edited by Myers, E. R. and Kingon, A. I. (Mater. Res. Soc. Symp. Proc. 200, Pittsburgh, PA, 1990), p. 297.Google Scholar
20.Ruddlesden, S. N. and Popper, P., Acta Cryst. 11, 54 (1958), JCPDS# 11–663.CrossRefGoogle Scholar
21.Etzold, K. F., Roy, R. A., Saenger, K. L., Lee, J. W., and Cuomo, J. J., Am. Ceram. Soc. Proc. (in press).Google Scholar
22.Dana, S. S., Etzold, K. F., and Clabes, J. G., J. Appl. Phys. 69, 4398 (1991).CrossRefGoogle Scholar
23.Francis, L. F. and Payne, D. A., in Ferroelectric Thin Films, edited by Myers, E. R. and Kingon, A. I. (Mater. Res. Soc. Symp. Proc. 200, Pittsburgh, PA, 1990), p. 173.Google Scholar
24.Matsubara, S., Yamamichi, S., Yamaguchi, H., and Miyazaki, Y., in Ferroelectric Thin Films, edited by Myers, E. R. and Kingon, A. I. (Mater. Res. Soc. Symp. Proc. 200, Pittsburgh, PA, 1990), p. 243.Google Scholar