Hostname: page-component-7479d7b7d-fwgfc Total loading time: 0 Render date: 2024-07-11T00:12:12.387Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of microstructural evolution on electrical property of the Sn–Ag–Cu solder balls joined with Sn–Zn–Bi paste

Published online by Cambridge University Press:  03 March 2011

Po-Cheng Shih  and
Kwang-Lung Lin
Po-Cheng Shih*
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan, Taiwan 701, Republic of China
Kwang-Lung Lin
Affiliation:
Department of Materials Science and Engineering, National Cheng-Kung University, Tainan, Taiwan 701, Republic of China
*
a)Address all correspondence to this author. e-mail: pj.shih@msa.hinet.net
Get access

Abstract

Sn–8Zn–3Bi solder paste and Sn–3.2Ag–0.5Cu solder balls were reflowed simultaneously on Cu/Ni/Au metallized ball grid array (BGA) substrates. The correlation between microstructural evolution and the electrical resistance of the joints under various testing conditions of reflow cycles and heat treatment was investigated. The electrical resistance of the Sn–Ag–Cu joints without Sn–Zn–Bi was also conducted for comparison. The average resistance values of Sn–Ag–Cu and Sn–Ag–Cu/Sn–Zn–Bi samples changed, respectively, from 7.1 (single reflow) to 7.3 (10 cycles) mΩ and from 7.2 (single reflow) to 7.6 (10 cycles) mΩ. Furthermore, the average resistance values of Sn–Ag–Cu and Sn–Ag–Cu/Sn–Zn–Bi samples changed, respectively, from 7.1 (aging 0 h) to 7.8 (aging 1000 h) mΩ and from 7.2 (aging 0 h) to 7.9 (aging 1000 h) mΩ. It was also noticeable that the average resistance values of Sn–Ag–Cu/Sn–Zn–Bi samples were higher than those of Sn–Ag–Cu samples in each specified testing condition. The possible reasons for the greater resistance exhibited by the Sn–Zn–Bi incorporated joints were discussed.

Keywords

AgingElectrical propertiesLayered
Type
Articles
Information
Journal of Materials Research , Volume 20 , Issue 10 , October 2005 , pp. 2854 - 2865
Copyright
Copyright © Materials Research Society 2005

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1Huang, X., Lee, S-W.R., Yan, C.C., and Hui, S.: Characterization and analysis on the solder ball shear testing conditions, electronic components and technology conference, in 2001 Proceedings, 51st, 29th May–1st June 2001, Orlando, FL, pp. 1065–1071.Google Scholar
2Chan, Y.C., Tu, P.L., Tang, C.W., Hung, K.C. and Lai, J.K.: Reliability studies of μBGA solder joints—Effect of Ni–Sn intermetallic compound. IEEE Trans. Adv. Pkg. 24, 25 (2001).CrossRefGoogle Scholar
3Sugizaki, T., Nakao, H., Kimura, T. and Watanabe, T.: BGA jointing property of Sn–8.8 mass% Zn and Sn–8.0 mass% Zn–3.0 mass% Bi Solder on electroless nickel-phosphorus/immersion gold plated substrates. Mater. Trans. 44, 1790 (2003).CrossRefGoogle Scholar
4Lee, C.B., Jung, S.B., Shin, Y.E. and Shur, C.C.: Effect of isothermal aging on ball shear strength in BGA joints with Sn–3.5Ag–0.75Cu solder. Mater. Trans. 43, 1858 (2002).CrossRefGoogle Scholar
5Lee, C.B., Lee, I.Y., Jung, S.B. and Shur, C.C.: Effect of surface finishes on ball shear strength in BGA joints with Sn–3.5 mass% Ag solder. Mater. Trans. 43, 751 (2002).CrossRefGoogle Scholar
6Uenishi, K., Kohara, Y., Sakatani, S., Saeki, T., Kobayashi, K.F. and Yamamoto, M.: Melting and joining behavior of Sn/Ag and Sn–Ag/Sn–Bi plating on Cu core ball. Mater. Trans. 43, 1833 (2002).CrossRefGoogle Scholar
7Nishiura, M., Nakayama, A., Sakatani, S., Kohara, Y., Uenishi, K. and Kobayashi, K.F.: Mechanical strength and microstructure of BGA joints using lead-free solders. Mater. Trans. 43, 1802 (2002).CrossRefGoogle Scholar
8Amagai, M., Watanabe, M., Omiya, M., Kishimoto, K. and Shibuya, T.: Mechanical characterization of Sn–Ag-based lead-free solders. Microelectron. Reliab. 42, 951 (2002).CrossRefGoogle Scholar
9Hirose, A., Fujii, T., Imamura, T. and Kobayashi, K.F.: Influence of interfacial reaction on reliability of QFP joints with Sn–Ag based Pb free solders. Mater. Trans. 42, 794 (2001).CrossRefGoogle Scholar
10Miyazawa, Y. and Ariga, T.: Influences of aging treatment on microstructure and hardness of Sn–(Ag, Bi, Zn) eutectic solder alloys. Mater. Trans. 42, 776 (2001).CrossRefGoogle Scholar
11Wu, J. and Pecht, M.G.: Contact resistance and fretting corrosion of lead-free alloy coated electrical contacts, in International IEEE Conference on Asian Green Electronics (AGEC) 2004 , pp. 127–135.Google Scholar
12Chonan, Y., Komiyama, T., Onuki, J., Urao, R., Kimura, T. and Nagano, T.: Influence of P content in electroless plated Ni–P alloy film on interfacial structures and strength between Sn–Zn solder and plated Au/Ni–P alloy film. Mater. Trans. 43, 1887 (2002).CrossRefGoogle Scholar
13Chuang, C.M., Shih, P.C. and Lin, K.L.: Mechanical strength of Sn–3.5Ag-based solders and related bondings. J. Electron. Mater. 33, 1 (2004).CrossRefGoogle Scholar
14Choi, J.W., Cha, H.S. and Oh, T.S.: Mechanical properties and shear strength of Sn–3.5Ag–Bi solder alloys. Mater. Trans. 43, 1864 (2002).CrossRefGoogle Scholar
15Jang, J.W., Frear, D.R., Lee, T.Y. and Tu, K.N.: Morphology of interfacial reaction between lead-free solders and electroless Ni–P under bump metallization. J. Appl, Phys. 88, 6359 (2000).CrossRefGoogle Scholar
16Bradley, E. III and Hranisavljevic, J.: Characterization of the melting and wetting of Sn–Ag–X solders, in Proceedings of the 50th Electronic Components and Technology Conference, Las Vegas, NV 2000 , pp. 1443–1448.Google Scholar
17Vianco, P.T. and Rejent, J.A.: Properties of ternary Sn–Ag–Bi solder alloys: Part I. Thermal properties and microstructural anaylsis. J. Electron. Mater. 28, 1127 (1999).CrossRefGoogle Scholar
18Vianco, P.T. and Rejent, J.A.: Properties of ternary Sn–Ag–Bi solder alloys: Part II. Wettability and mechanical properties anaylsis. J. Electron. Mater. 28, 1138 (1999).CrossRefGoogle Scholar
19Kariya, Y. and Otsuka, M.: Effect of bismuth on the isothermal fatigue properties of Sn–3.5mass% Ag solder alloy. J. Electron. Mater. 27, 866 (1998).CrossRefGoogle Scholar
20Abtew, M. and Selvaduray, G.: Lead-free solders in microelectronics. Mater. Sci. Eng. R 27, 95 (2000).CrossRefGoogle Scholar
21Kang, S.K., Choi, W.K., Shih, D.Y., Lauro, P., Henderson, D.W., Gosselin, T., and Leonard, D.N.: Interfacial reactions, microstructure and mechanical properties of Pb-free solder joints in PBGA laminates, in Proceedings of the 52nd Electronic Components and Technology Conference, San Diego, CA, pp. 146–153.Google Scholar
22Liao, C.N. and Wei, C.T.: Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment. J. Electron. Mater. 33, 1137 (2004).CrossRefGoogle Scholar
23Ahat, S., Sheng, M. and Luo, L.: Microstructure and shear strength evolution of SnAg/Cu surface mount solder joint during aging. J. Electron. Mater. 30, 1317 (2001).CrossRefGoogle Scholar
24He, M., Chen, Z. and Qi, G.: Solid state interfacial reaction of Sn–37Pb and Sn–3.5Ag solders with Ni–P under bump metallization. Acta Mater. 52, 2047 (2004).CrossRefGoogle Scholar
25Pang, J.H.L., Xiong, B.S., Neo, C.C., Zhang, X.R., and Low, T.H.: Bulk solder and solder joint properties for lead free 95.5Sn–3.8Ag–0.7Cu solder alloy, in Proceedings of the 53rd Electronic Components and Technology Conference, New Orleans, LA2003 , pp. 673–679.Google Scholar
26Shih, P.C. and Lin, K.L.: Interfacial bonding behavior with introduction of Sn–Zn–Bi paste to Sn–Ag–Cu ball grid array package during multiple reflows. J. Mater. Res. 20, 219 (2005).CrossRefGoogle Scholar
27Kang, S.K., Choi, W.K., Yim, M.J. and Shih, D.Y.: Studies of the mechanical and electrical properties of lead-free solder joints. J. Electron. Mater. 31, 1292 (2002).CrossRefGoogle Scholar
28Cook, B.A., Anderson, I.E., Harringa, J.L. and Terpstra, R.L.: Effect of heat treatment on the electrical resistivity of near-eutectic Sn–Ag–Cu Pb-free solder alloys. J. Electron. Mater. 31, 1190 (2002).CrossRefGoogle Scholar
29Kang, S.K., Horkans, J., And, P.C.ricacos, Carruthers, R.A., Cotte, J., Datta, M., Gruber, P., Harper, J.M.E., Kwietniak, K., Sambucetti, C., Shi, L., Brouillette, G., and Danovitch, D.: Pb-free solder alloys for flip chip applications, in Proceedings of the 49th Electronic Components and Technology Conference San Diego, CA 1999 , pp. 283–288.Google Scholar
30Frederikse, H.P.R., Fields, R.J. and Feldman, A.: Thermal and electrical properties of copper-tin and nickel-tin intermetallics. J. Appl. Phys. 72, 2879 (1992).CrossRefGoogle Scholar
31Seitz, F.: The Modern Theory of Solids McGraw-Hill, New York, 1940 , pp. 10–12.Google Scholar
32Handbook of Chemistry and Physics, 43rd ed. (Chemical Rubber Publishing, 1961) , pp. 2626–2633.Google Scholar
33Chiou, B.S., Liu, K.C., Duh, J.G. and Palanisamy, P.S.: Intermetallic formation on the fracture of Sn/Pb solder and Pd/Ag conductor interfaces. IEEE Trans. Comp., Hybrids Mfg. Technol. 13, 267 (1990).CrossRefGoogle Scholar
34Yoon, J.W., Kim, S.W., Koo, J.M., Kim, D.G. and Jung, S.B.: Reliability investigation and interfacial reaction of ball-grid-array packages using the lead-free Sn–Cu solder. J. Electron. Mater. 33, 1190 (2004).CrossRefGoogle Scholar