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Monolithically-integrated 3D printed coaxial bandpass filters and RF diplexers: single-band and dual-band

Published online by Cambridge University Press:  05 November 2021

Kunchen Zhao Open the ORCID record for Kunchen Zhao [Opens in a new window]  and
Dimitra Psychogiou
Kunchen Zhao*
Affiliation:
Department of Electrical, Computer, and Energy Engineering, University of Colorado Boulder, Boulder, CO, USA
Dimitra Psychogiou
Affiliation:
Department of Electrical, Computer, and Energy Engineering, University of Colorado Boulder, Boulder, CO, USA University of College Cork and Tyndall National Institute, Lee Maltings, Dyke Parade, Cork, T12 R5CP, Ireland
*
Author for correspondence: Kunchen Zhao, E-mail: kunchen.zhao@colorado.edu
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Abstract

The manuscript reports on additively-manufactured (AM) coaxial-resonator-based bandpass filters (BPFs) and RF diplexers. A monolithic integration concept using stereolithography apparatus (SLA) is proposed and discussed in detail. Coupled-resonator-based synthesis alongside full-electromagnetic-based design methods is used for the design of the monolithic filters and RF diplexers. In particular, the paper discusses a new external coupling mechanism for dual-band BPFs that allow to independently control the coupling in each of the BPF passbands. Furthermore, a novel coaxial transmission line-type T-junction is proposed for the design of single- and dual-band RF diplexers. For practical validation purposes, multiple BPF and RF diplexer prototypes were designed, manufactured and tested at S- and C-band demonstrating the applicability of the proposed concept to low-cost, low-loss and low-weight RF components with complex geometrical features.

Keywords

3D printingadditive manufacturingdual-band diplexerdual-band filterhigh-Q filterRF diplexerRF filter
Type
Research Paper
Information
International Journal of Microwave and Wireless Technologies , Volume 14 , Special Issue 3: Filters and Multiplexers for Satellite Communications Systems , April 2022 , pp. 293 - 304
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Copyright
Copyright © The Author(s), 2021. Published by Cambridge University Press in association with the European Microwave Association

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