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Antenna-in-package (AiP) in mm-wave band

Published online by Cambridge University Press:  23 January 2013

Mahmoud Alhenawy  and
Martin Schneider
Mahmoud Alhenawy*
Affiliation:
Institute of Telecommunications and High-Frequency Techniques, RF & Microwave Engineering Laboratory, University of Bremen, Bremen, Germany. Phone: +4942121862417
Martin Schneider
Affiliation:
Institute of Telecommunications and High-Frequency Techniques, RF & Microwave Engineering Laboratory, University of Bremen, Bremen, Germany. Phone: +4942121862417
*
Corresponding author: M. Alhenawy Email: mahmoud.alhenawy@hf.uni-bremen.de
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Abstract

We studied the viability of the embedded wafer level ball grid array (eWLB) package environment as an antenna platform for 77 GHz automotive radar sensors and the effects of package fabrication tolerances on the antenna performance. The investigation of different antenna concepts in the eWLB package and their characterization methods are addressed. The design procedures for electrically large, differentially fed loop antennas in a multilayer package structure are introduced. Two different planar antennas are developed and measured in an eWLB package showing promising results such as a gain of 9 GHz and an impedance bandwidth of 8 GHz. An acceptable antenna performance is recorded within the tolerance limits. Therefore, the eWLB package is seen as an appropriate platform for mm-wave antennas and as a good candidate for an antenna-in-package (AiP) concept.

Keywords

Antenna designModelling and measurementsRadar application
Type
Research Papers
Information
International Journal of Microwave and Wireless Technologies , Volume 5 , Special Issue 1: Special Issue on the German RoCC Project , February 2013 , pp. 55 - 64
Copyright
Copyright © Cambridge University Press and the European Microwave Association 2013

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References

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