Zhang, Y.P.; Liu, Duixian. etc: Antenna-on-chip and antenna-in-package solutions to highly integrated millimeter-wave devices for wireless communications. IEEE Trans. Antennas Propag., 57 (10): (2009), 2830–2841.
Hasch, J.; Wostradowski, U.; Gaier, S.; Hansen, T. etc: 77 GHz radar transceiver with dual integrated antenna elements. in German Microwave Conf., Berlin, Germany, March 2010, 280–283.
Takeuchi, J., Hirata, A., Takahashi, H., and Kukutsu, N.: 10-Gbit/s bi-directional and 20-Gbit/s uni-directional data transmission over a 120-GHz-band wireless link using a finline ortho-mode transducer, in Microwave Conf. Proc. (APMC), 2010 Asia-Pacific, Yokohama, Japan, December 2010, 195–198.
Lopez, A.V., Papapolymerou, J., Akiba, A., Ikeda, K., Mitarai, S., and Ponchak, G.: 60 GHz micromachined patch antenna for wireless applications, in IEEE Int. Symp. on Antennas and Propagation (APSURSI), Washington, USA, July 2011, 515–518, doi: 10.1109/APS.2011.5996758.
Carrillo-Ramirez, R. and Jackson, R.W.: A Highly Integrated Millimeter-wave Active Antenna Array Using BCB and Silicon Substrate. IEEE Trans. Microw. Theory Tech., 52 (6) (2004), 1648–1653.
Alhenawy, M. and Schneider, M.: Integrated antennas in eWLB packages for 77 GHz and 79 GHz automotive radar sensors, in 41st European Microwave Conf. (EuMC), Manchester, United kingdom, October 2011, 1312 –1315.
Fischer, A., Tong, Ziqiang, Hamidipour, A., Maurer, L., and Stelzer, A.: A 77-GHz antenna in package, in 41st European Microwave Conf. (EuMC), Manchester, United kingdom, October 2011, 1316–1319.
Brunnbauer, M., Furgut, E., Beer, G., and Meyer, T.: Embedded wafer level ball grid array (eWLB), in Eighth Electronics Packaging Technology Conf., EPTC '06, Singapore, December 2006, 1–5, doi: 10.1109/EPTC.2006.342681.
Meyer, T., Ofner, G., Bradl, S., Brunnbauer, M., and Hagen, R.: Embedded wafer level ball grid array (eWLB), in 10th Electronics Packaging Technology Conf., 2008. EPTC, Singapore, December 2008, 994–998, doi: 10.1109/EPTC.2008.4763559.
Pressel, K., et al. : Embedded wafer level ball grid array (eWLB) technology for system integration, in IEEE CPMT Symp. Japan, 2010, August 2010, 1–4, doi: 10.1109/CPMTSYMPJ.2010.5679657.
Alhenawy, M. and Schneider, M.: Rectangular waveguide to coplanar stripline transition based on a unilateral finline, in Proc. Fourth European Conf. on Antennas and Propagation (EuCAP), Prague, Czech Republic, April 2012.
Pocklington, H.C.: Electrical oscillations in wires, in Cambridge Philosophical Society Proc., University Press, volume 9, 1897, 324.