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5 - Space-Based Advanced Thermal Conductance and Storage Technologies

Published online by Cambridge University Press:  19 June 2020

Eric A. Silk
Affiliation:
University of Maryland, College Park
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Summary

At the end of Chapter 4 we had begun to perform temperature analysis of components internal to a SpaceCube in LEO. In the analysis procedure we determined that it would be necessary to implement a thermal coupling between the E-box and the radiator in order to remove heat from the E-box and reduce its operational temperature.

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Publisher: Cambridge University Press
Print publication year: 2020

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