CZT is a semiconductor material that promises to be a good candidate for uncooled gamma radiation detectors. However, to date, technological difficulties in production of large size defect-free CZT crystals are yet to be overcome. The most common problem is accumulation of tellurium precipitates as microscopic inclusions. These inclusions influence the charge collection through charge trapping and electric field distortion. The common work-around solutions are to fabricate pixelated detectors by either grouping together many small volume CZT crystals to act as individual detectors, or to deposit a pixelated grid of electrical contacts on a larger, but defective, crystal, and selectively collect charge. These solutions are satisfactory in an R&D environment, but are unsuitable for mass production and commercial development. Our modeling effort is aimed at quantifying the various contributions of tellurium inclusions in CZT crystals to the charge generation, transport, and collection, as a function of inclusions size, position, and concentration. We model the energy deposition of gamma photons in the sensitive volume of the detector using LANL’s MCNP code. The electron-hole pairs produced at the energy deposition sites are then transported through the defective crystal and collected as integral charge at the electrical contact sites using CERN’s Garfield software package. The size and position distribution of tellurium inclusions is modeled by sampling experimentally measured distributions of such inclusions on a variety of commercially-grown CZT crystals using IR microscopy and image processing software packages.

Cadmium Zinc Telluride (CZT), considered as a viable material for use in room temperature radiation detectors, has an undesired presence of tellurium inclusions in the bulk. Thermal treatment, in the form of annealing, has been utilized to test the viability of refining CZT into better detector material, either by the elimination of the tellurium inclusions or by the migration of the inclusions under a temperature gradient, but usually with a deterioration of electrical properties. We took infrared micrographs and current voltage (IV) characteristics of CZT samples prior to thermal treatment. We carried out 24-hour thermal treatments with a range of temperature from 100°C to 700°C to determine an optimal annealing temperature and to verify changes in the sizes, morphologies, and locations of the tellurium inclusions on the surfaces and within the crystal bulk of the CZT. The IV curves and resistivities prior to and after thermal treatments were compared, as were the infrared micrographs before and after annealing. Also, the changes in electrical properties of the samples with annealing conditions were compared against structural changes monitored at the same steps during the annealing process, in order to understand the effects of the thermal annealing to the radiation detector properties of the material. Correlations between the shape, size and position of inclusions and electrical properties of the material were attempted.

The performance of the thermoelectric devices and materials is shown by a dimensionless figure of merit, ZT = S2σT/K, where S is the Seebeck coefficient, σ is the electrical conductivity, T is the absolute temperature and K is the thermal conductivity. ZT can be increased by increasing S, increasing σ or decreasing K. We have prepared 100 alternating nanolayered films of SiO2/SiO2+CoSb3 using the ion beam assisted deposition (IBAD). The 5 MeV Si ions bombardments have been performed using the AAMU Pelletron ion beam accelerator to make quantum clusters in the nanolayered superlattice films at the three different fluences to decrease the cross plane thermal conductivity, increase the cross plane Seebeck coefficient and cross plane electrical conductivity. We have characterized 100 alternating nanolayered films of SiO2/SiO2+CoSb3 before and after Si ion bombardments as we measured the cross-plane Seebeck coefficient, the cross-plane electrical conductivity, and the cross-plane thermal conductivity for three different fluences.

The performance of the thermoelectric materials and devices is shown by a dimensionless figure of merit, ZT = S2σT/K, where S is the Seebeck coefficient, σ is the electrical conductivity, T is the absolute temperature and K is the thermal conductivity. ZT can be increased by increasing S, increasing σ, or decreasing K. We have prepared 100 alternating multi-nano layer of SiO2/SiO2+Cu superlattice films using the ion beam assisted deposition (IBAD). The 5 MeV Si ions bombardments have been performed at the different fluences using the AAMU Pelletron ion beam accelerator to make quantum clusters in the multi-layer superlattice thin films to decrease the cross plane thermal conductivity increase the cross plane Seebeck coefficient and cross plane electrical conductivity. To characterize the thermoelectric thin films before and after Si ion bombardments we have measured the cross-plane Seebeck coefficient, the cross-plane electrical conductivity, and the cross-plane thermal conductivity for different fluences.

We have prepared 100 periodic nano-layers of SiO2/AgSiO2 with Au layer deposited on both sides as metal contacts. The deposited multi-layer films have a periodic structure consisting of alternating layers where each layer is 3.3 nm thick. The purpose of this research is to tailor the figure of merit of the thermoelectric materials generated from the nanolayers of nanocrystals of Ag with SiO2 as host and as buffer layer using a combination of co-deposition and MeV ions bombardment taking advantage of energy deposited in the MeV ion track to nucleate nanoclusters. The electrical and thermal properties of the nanolayered structures were studied before and after 5 MeV Si ions bombardment at various fluences to form nanocrystals. In addition to thermoelectric properties, some optical properties of the SiO2/SiO2+Ag multi-layer superlattice films have been studied.

The efficiency of the thermoelectric devices is limited by the properties of n- and p-type semiconductors. Effective thermoelectric materials have a low thermal conductivity and a high electrical conductivity. The performance of the thermoelectric materials and devices is shown by a dimensionless figure of merit, ZT = S2σT/K, where S is the Seebeck coefficient, σ is the electrical conductivity, T is the absolute temperature and K is the thermal conductivity. In this study we prepared the thermoelectric generator device of SiO2/SiO2+Au multi-layer super-lattice films using the ion beam assisted deposition (IBAD). In order to determine the stoichiometry of the elements of SiO2 and Au in the grown multilayer films and the thickness of the grown multi-layer films Rutherford Backscattering Spectrometry (RBS) and RUMP simulation software package was used. The 5 MeV Si ion bombardments was performed to make quantum clusters in the multi-layer super-lattice thin films to decrease the cross plane thermal conductivity, increase the cross plane Seebeck coefficient and cross plane electrical conductivity. To characterize the thermoelectric generator devices before and after Si ion bombardments we measured the cross-plane Seebeck coefficient, the cross-plane electrical conductivity, and the cross-plane thermal conductivity for different fluences.

The TRISO fuel that is intended to be used for the generation IV nuclear reactor design consists of a fuel kernel of Uranium Oxide (UOx) coated in several layers of materials with different functions. One consideration for some of these layers is Silicon Carbide (SiC) [1]. The design, manufacture and fabrication of SiC are done at the Center for Irradiation of Materials (CIM). This light weight material can maintain dimensional and chemical stability in adverse environments and very high temperatures. The characterization of the elemental makeup of the SiC material used is done using X-ray photoelectron spectroscopy (XPS). Nano-indentation is used to determine the hardness, stiffness and Young's Modulus of the material. Raman Spectroscopy is used to characterize the chemical bonding for different sample preparation temperatures.

Effective thermoelectric materials have a low thermal conductivity and a high electrical conductivity. The performance of the thermoelectric materials and devices is shown by a dimensionless figure of merit, ZT = S2sσ/ KTC, σ is the electrical conductivity T/KTC, where S is the Seebeck coefficient, T is the absolute temperature and KTC is the thermal conductivity. In this study we have prepared the thermoelectric generator device of Si/Si+Ge multi-layer superlattice films using the ion beam assisted deposition (IBAD). To determine the stoichiometry of the elements of Si and Ge in the grown multilayer films and the thickness of the grown multi-layer films Rutherford Backscattering Spectrometry (RBS) and RUMP simulation software package were used. The 5 MeV Si ion bombardments were performed to make quantum clusters in the multi-layer superlattice thin films to decrease the cross plane thermal conductivity, increase the cross plane Seebeck coefficient and cross plane electrical conductivity.

Keywords: Ion bombardment, thermoelectric properties, multi-nanolayers, Figure of merit.

The TRISO fuel has been used in some of the Generation IV nuclear reactor designs [1,2]. It consists of a fuel kernel of UOx coated with several layers of materials with different functions. Pyrolytic carbon (PyC) is one of the materials in the layers. In this study we investigate the possibility of using Glassy Polymeric Carbon (GPC) as an alternative to PyC. In this work, we are comparing the changes in physical and microstructure properties of GPC after exposure to irradiation fluence of 5 MeV Au equivalent to a 1 displacement per atom (dpa) at samples prepared at 1000, 1500 and 2000°C. The GPC material is manufactured and tested at the Center for Irradiation Materials (CIM) at Alabama A&M University. Transmission electron microscopy (TEM), Rutherford backscattering spectroscopy (RBS), X-ray photoelectron spectroscopy (XPS) and Raman spectroscopy were used for the analysis.

Monolayer thin films of YbBiPt and YBiPt have been produced with 560 nm and 394 nm thick respectively in house and their thermoelectric properties were measured before and after MeV ion bombardment. The energy of the ions were selected such that the bombarding Si ions stop in the silicon substrate and deposit only electronic energy by ionization in the deposited thin film. The bombardment by 5.0 MeV Si ions at various fluences changed the homogeneity as well as reducing the internal stress in the films thus affecting the thermal, electrical and Seebeck coefficient of thin films. The stoichiometry of the thin films was determined using Rutherford Backscattering Spectrometry, the thickness has been measured using interferometry and the electrical conductivity was measured using Van der Pauw method. Thermal conductivity of the thin films was measured using an in-house built 3ω thermal conductivity measurement system. Using the measured Seebeck coefficient, thermal conductivity and electrical conductivity we calculated the figure of merit (ZT). We will report our findings of change in the measured figure of merit as a function of bombardment fluence.

We have grown 100 periodic SiO2/SiO2+Ag multi-nano-layered systems where the SiO2+Ag layers were 7.26 nm and SiO2 buffer layer were 4 nm, total thickness is 563 nm. Using interferometer as well as in-situ thickness monitoring, we measured the thickness of the layers; using Rutherford Backscattering Spectrometry (RBS) measured the concentration and distribution of Ag in SiO2. The electrical conductivity, thermal conductivity and the Seebeck coefficient of the layered structure were measured at room temperature before and after bombardment by 5 MeV Si ions. The energy of the Si ions were chosen such that the ions are stopped in the silicon substrate and only electronic energy due to ionization is deposited in the layered structure. The electrical conductivity measured using Van der Pauw method. Thermal conductivity of the thin films was measured using an in-house built 3ω thermal conductivity measurement system. Using the measured Seebeck coefficient, thermal conductivity and electrical conductivity we calculated the figure of merit (ZT). We will report our findings of change in the figure of merit as a function of the bombardment fluence.

We have used MeV ion beams to fabricate nanopores in Poly(tetrafluorethylene-co-perfluoro-(propyl vinyl ether)) (PFA) fluoropolymer membranes. We have developed an in house system to produce nanopores. Using MeV ion beams we developed a method to produce pores from nanometers to one-micron diameter. A thin film of the PFA polymer was mounted to cover a window to a gas filled chamber and then exposed to a uniformly scanned MeV ion beam masked to define the exposed area. The gas leak rate through the fabricated pores was monitored by an in situ RGA system both during and after each bombardment to correlate the leakage with the total area of the pores produced. In this project we used MeV light and heavy ions to best define the pore diameter through each hole and the pore entrance and exit dimensions in the membranes.

Silicon carbide is a promising wide-bandgap semiconductor intended for use in fabrication of high temperature, high power, and fast switching microelectronics components running without cooling. For hydrogen sensing applications, silicon carbide is generally used in conjunction with either palladium or platinum, both of them being good catalysts for hydrogen. Here we are reporting on the temperature-dependent depth profile modifications of tungsten electrical contacts deposited on silicon carbide substrates.

We have introduced various nanopowders in the precursor of glassy polymeric carbon (GPC) and studied its electrical, thermal, and mechanical properties as well as its chemical structure. In general the GPC ware produced at AAMU is used for making crucibles, heat exchangers, and for prosthetic devices because of its biocompatibility. GPC ware at AAMU is synthesized from a phenolic resin solution from Georgia Pacific in a pyrolyser system at temperatures between 100 °C all the way to 2800 °C. The heat treatment includes several stages: gelling, curing, postcuring, precarbonization and carbonization. The fabrication of GPC is complicated because of the high production rate of gaseous products in critical temperature ranges where out-diffusion is relatively slow. Special care should be taken in temperature programming to avoid kilning faults and misshapen or porous GPC end results. In this work we have introduced SiC, CNT or Al2O3 to the precursor and studied the properties of the final product treated at 1000oC pyrolysis temperature.

Glassy Polymeric Carbon (GPC) is obtained by a molding technique, in various shapes, from a phenolic resin precursor. The heat treatment of the precursor is achieved in three stages up to 1000 °C. Similar GPC materials produced in our laboratory displayed large strain to failure ratio, small thermal expansion coefficient and low density. Like all carbon forms, is attacked by oxygen, especially atomic oxygen. Nevertheless the kinetics for reaction with atmospheric oxygen is very slow. We investigated the composition and structural changes of the phenolic precursor as a function of temperature and evaluated materials stability when exposed to high temperatures in presence of hydrogen or oxygen.

Biocompatible Glassy Polymeric Carbon (GPC) is used for artificial heart valves and in other biomedical applications. Although it is ideally suited for implants in the blood stream, tissue that normally forms around the moving parts of a GPC heart valve sometimes loses adhesion and creates embolisms downstream. Here we compare silver ion implantation and silver deposition, each of which strongly inhibits cell attachment on GPC. Inhibition of cell adhesion is a desirable improvement to current GPC cardiac implants. In vitro biocompatibility tests have been carried out with model cell lines to demonstrate that traces of silver can favorably influence the surface of GPC for biomedical applications.

Silicon carbide is a promising wide-bandgap semiconductor intended for use in fabrication of high temperature, high power, and fast switching microelectronics components running without cooling. For hydrogen sensing applications, silicon carbide is generally used in conjunction with either palladium or platinum, both of them being good catalysts for hydrogen. Here we are reporting on the temperature-dependent surface morphology and depth profile modifications of Au, Ti, and W electrical contacts deposited on silicon carbide substrates implanted with 20 keV Pd ions.

The work reported here deals with studying the defects induced by heavy ion implantation as well as the degree of crystalline lattice recovery after annealing in a high purity argon environment between 600 and 1600 °C. We implanted 6H, n-type silicon carbide with Pd and Au ions at 1015 ions/cm2, and used Micro-Raman (MR) and optical absorption (OA) spectroscopy techniques for investigating the lattice properties and damage evolution at various stages during the fabrication process.

The work reported here deals with studying the defects induced by light ion (Al, N) implantation in 4H and 6H silicon carbide, both p-type (Al-doped) and n-type (N-doped). Confocal Micro-Raman (MR) was used for monitoring the (480 – 540) cm-1 spectral region of amorphous silicon. A broad peak forms in this region because of silicon atoms relocated as interstitials, translating into a locally stressed crystalline lattice. The locally relaxed lattice at these atoms' locations of origin also gives a broadening of the characteristic Raman peaks of each type of material. UV/Vis Optical Absorption (OA) Spectroscopy has also been employed as a good tool for dopant and carrier trapping levels embedded in the band gap of the silicon carbide material. MR and OA data collected from virgin samples, as implanted, and after annealing at two different temperatures (1100 and 1600 °C) are discussed in this paper.