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We describe the new species ognitite, NiBiTe, and a Co-rich variety of maucherite, hitherto unreported; both were discovered in the Ognit ultramafic complex of Neoproterozoic age in Eastern Sayans, Russia. The mean composition of ognitite (n = 7) is: Ni 17.05, Fe 0.07, Cu 0.14, Pd 0.14, Te 32.53, Bi 49.64, total 99.57 wt.%, corresponding to: (Ni1.11Cu0.008Fe0.005Pd0.005)Σ1.13Bi0.90Te0.97 (Σ atoms = 3 apfu). Ognitite is trigonal, space group P3m1 [R1 = 0.0276 for 81 reflections with Fo > 4σ(Fo)]. The unit-cell parameters derived from the single-crystal X-ray diffraction data are: a = 3.928(1) Å, c = 5.385(1) Å and V = 71.95(4) Å3, with Z = 1. The c:a ratio is 1.37. The powder X-ray diffraction data obtained on the same fragment used for the single-crystal study are: a = 3.9332(4) Å, c = 5.3920(6) Å and V = 72.24(1) Å3. Ognitite exhibits the brucite-type structure with edge-sharing NiTe3Bi3 octahedra forming sheets parallel to (0001). It is related to melonite, but is distinct compositionally by the extreme Bi-enrichment (melonite and its synthetic analogue contain <0.4 Bi apfu), and structurally as Bi and Te are ordered at two distinct sites, leading to the loss of the centre of symmetry in ognitite.
At more than 9 wt.% Co, or ~2 apfu Co, the core of Co-rich maucherite [(Ni,Co)11As8] in a zoned crystal, which is surrounded by Co-depleted orcelite, far surpasses the norm (≤1 and up to 3.9 wt.% Co). The unit-cell parameters of the Co-rich maucherite are: a = 6.85(2) and c = 21.83(5) Å, which are based on results of synchrotron micro-Laue diffraction.
The host rock consists of serpentine, clinochlore (Mg# 95–97) and skeletal chromite. We favour the metastable crystallisation of fluid-saturated globules of a sulfide–arsenide melt to explain the anomalous compositions of ore minerals at Ognit. These anomalies seem consistent with rapid cooling in a fluid-enriched system, possibly related to late-stage degassing of the magma, as reflected in a prominent metasomatic aureole at the contact with the enclosing gneissic rocks.
Silicon is a promising material for lithium-ion batteries. However, it expands by 300% on lithiation, leading to fracture. Nanostructuring of silicon is expected to be a promising method to improve the mechanical strength of the silicon electrodes. In the present work, a unique battery test cell was designed and fabricated to study the in situ stress evolution in the silicon nanowire (SiNW) electrode during electrochemical lithiation using synchrotron X-ray microdiffraction. The stress in the SiNWs at pristine state and during lithiation was evaluated using energy scans. The average stress in the pristine nanowires was found to be ∼40 MPa tensile, which changed to ∼325 MPa compressive on lithiation. Further, the deviatoric stress state in the SiNWs during lithiation was evaluated using Laue diffraction and the lithiated nanowires were found to be in triaxial stress state with high shear stresses. The technique and the findings provide new and more in-depth understanding of the stress evolution in the SiNWs during electrochemical lithiation.
Fracture of crystalline silicon (c-Si) solar cells in photovoltaic modules is a big concern to the photovoltaics (PV) industry. Cell cracks cause performance degradation and warranty issues to the manufacturers. The roots of cell fractures lie in the manufacturing and integration process of the cells and modules as they go through a series of elevated temperature and pressure processes, involving bonding of dissimilar materials, causing residual stresses. Evaluation of the exact physical mechanisms leading to these thermomechanical stresses is highly essential to quantify them and optimize the PV modules to address them. We present a novel synchrotron X-ray microdiffraction based techniques to characterize the stress and fracture in the crystalline silicon PV modules. We show the detailed stress state after soldering and lamination process, using the synchrotron X-ray microdiffraction experiments. We also calculate the maximum tolerable microcrack size in the c-Si cells to sustain the residual stress after lamination. We further demonstrate the effect of these residual stresses on the cell fractures using the widely accepted fracture (4-point bending) tests. These test results show that the soldering and lamination induced localized residual stresses indeed reduce the load-carrying capacity of the c-Si cells.
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