6 results
PCA Characterization of Residual Subsurface Damage After Silicon Wafer Mirror Polishing and its Removal
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- Journal:
- MRS Online Proceedings Library Archive / Volume 566 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 261
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- 1999
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Lifetime Characterization of Poly-Silicon Back Sealed Wafers with Bi-Surface Photoconductivity Decay Method
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- Journal:
- MRS Online Proceedings Library Archive / Volume 477 / 1997
- Published online by Cambridge University Press:
- 10 February 2011, 329
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- 1997
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Mirror-Polishing Residual Damage characterization in the Subsurface of Si Wafers Using N2 Laser /mm-Wave Photoconductivity Amplitude Technique
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- Journal:
- MRS Online Proceedings Library Archive / Volume 477 / 1997
- Published online by Cambridge University Press:
- 10 February 2011, 209
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- 1997
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Microwave Skin Effect in Noncontact Photoconductivity Decay Measurements in Si Wafers
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- Journal:
- MRS Online Proceedings Library Archive / Volume 430 / 1996
- Published online by Cambridge University Press:
- 10 February 2011, 93
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- 1996
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Microwave Separation Measurements of Bulk Lifetime and Surface Recombination Velocities in Si Wafers with Various Surface Properties
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- Journal:
- MRS Online Proceedings Library Archive / Volume 430 / 1996
- Published online by Cambridge University Press:
- 10 February 2011, 79
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- 1996
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Noncontact Photoconductivity Amplitude Technique to Characterize Polishing- and Slicing-Induced Residual Damage in Si Wafers
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- Journal:
- MRS Online Proceedings Library Archive / Volume 378 / 1995
- Published online by Cambridge University Press:
- 26 February 2011, 591
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- 1995
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