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Understanding the effect of impurities and grain boundaries on mechanical behavior of Si via nanoindentation of (110)/(100) direct Si bonded wafers
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- Journal:
- Journal of Materials Research / Volume 27 / Issue 1 / 14 January 2012
- Published online by Cambridge University Press:
- 27 September 2011, pp. 349-355
- Print publication:
- 14 January 2012
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- Article
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