4 results
32nm Node Highly Reliable Cu/Low-k Integration Technology with CuMn Alloy Seed
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1335 / 2011
- Published online by Cambridge University Press:
- 10 August 2011, mrss11-1335-o06-02
- Print publication:
- 2011
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Re-emergence of Francisella tularensis in Germany: fatal tularaemia in a colony of semi-free-living marmosets (Callithrix jacchus)
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- Journal:
- Epidemiology & Infection / Volume 135 / Issue 8 / November 2007
- Published online by Cambridge University Press:
- 19 February 2007, pp. 1256-1265
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- Article
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Effect of Dielectric Pore Size Distribution on Interfacial Adhesion of the Tantalum-Porous Dielectric Interface
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- Journal:
- MRS Online Proceedings Library Archive / Volume 863 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, B6.6
- Print publication:
- 2005
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Integration of PECVD Tungsten Nitride as a Barrier Layer for Copper Metallization
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- Journal:
- MRS Online Proceedings Library Archive / Volume 564 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 321
- Print publication:
- 1999
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