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Integration and Characterization of Low Carbon Content SiOxCyHz Low κ Materials for < 0.18μm[ Dual Damascene Application
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- Journal:
- MRS Online Proceedings Library Archive / Volume 612 / 2000
- Published online by Cambridge University Press:
- 17 March 2011, D3.4.1
- Print publication:
- 2000
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In‐Situ Mapping and Modeling Verification of Thermomechanical Deformation in Underfilled Flip‐Chip Packaging Using Moiré Interferometry
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- Journal:
- MRS Online Proceedings Library Archive / Volume 445 / 1996
- Published online by Cambridge University Press:
- 10 February 2011, 167
- Print publication:
- 1996
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- Article
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