14 results
High Carrier Lifetime Bulk-Grown 4H-SiC Substrates for Power Applications
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- Journal:
- MRS Online Proceedings Library Archive / Volume 911 / 2006
- Published online by Cambridge University Press:
- 01 February 2011, 0911-B01-03
- Print publication:
- 2006
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Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding
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- Journal:
- MRS Online Proceedings Library Archive / Volume 863 / 2005
- Published online by Cambridge University Press:
- 01 February 2011, B10.8
- Print publication:
- 2005
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Evaluation of Thin Dielectric-Glue Wafer-Bonding for Three Dimensional Integrated Circuit-Applications
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- Journal:
- MRS Online Proceedings Library Archive / Volume 812 / 2004
- Published online by Cambridge University Press:
- 17 March 2011, F6.16
- Print publication:
- 2004
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Fundamental Limits for 3D Wafer-to-Wafer Alignment Accuracy
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- Journal:
- MRS Online Proceedings Library Archive / Volume 812 / 2004
- Published online by Cambridge University Press:
- 17 March 2011, F6.10
- Print publication:
- 2004
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Planarization Issues in Wafer-Level Three-Dimensional (3D) Integration
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- Journal:
- MRS Online Proceedings Library Archive / Volume 816 / 2004
- Published online by Cambridge University Press:
- 15 March 2011, K7.7
- Print publication:
- 2004
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Dielectric GlueWafer Bonding For 3D ICs
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- Journal:
- MRS Online Proceedings Library Archive / Volume 766 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, E5.8
- Print publication:
- 2003
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Wafer Thinning for Monolithic 3D Integration
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- Journal:
- MRS Online Proceedings Library Archive / Volume 766 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, E5.7
- Print publication:
- 2003
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Slurries for Copper Damascene Patterning: Similarities and Differences
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- Journal:
- MRS Online Proceedings Library Archive / Volume 767 / 2003
- Published online by Cambridge University Press:
- 01 February 2011, F6.8
- Print publication:
- 2003
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Wafer Bonding Using Dielectric Polymer Thin Films in 3D Integration
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- Journal:
- MRS Online Proceedings Library Archive / Volume 710 / 2001
- Published online by Cambridge University Press:
- 17 March 2011, DD12.18.1
- Print publication:
- 2001
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Non-Contact Characterization of Recombination Processes in 4H-SiC
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- Journal:
- MRS Online Proceedings Library Archive / Volume 622 / 2000
- Published online by Cambridge University Press:
- 15 March 2011, T4.4.1
- Print publication:
- 2000
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A Novel Single Step Lapping and Chemo-Mechanical Polishing Scheme for Antimonide Based Semiconductors Using 1 µm Agglomerate-Free Alumina Slurry
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- Journal:
- MRS Online Proceedings Library Archive / Volume 613 / 2000
- Published online by Cambridge University Press:
- 14 March 2011, E4.1.1
- Print publication:
- 2000
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Microstructural Characterization of Antimonide Based III-V Compounds and their Effect On Electro-Optical Properties of Substrate Materials and Devices
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- Journal:
- MRS Online Proceedings Library Archive / Volume 588 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 187
- Print publication:
- 1999
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Surface Layer Formation During the Chemical Mechanical Polishing of Copper Thin Films
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- Journal:
- MRS Online Proceedings Library Archive / Volume 337 / 1994
- Published online by Cambridge University Press:
- 25 February 2011, 133
- Print publication:
- 1994
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Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing
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- Journal:
- MRS Bulletin / Volume 18 / Issue 6 / June 1993
- Published online by Cambridge University Press:
- 29 November 2013, pp. 46-51
- Print publication:
- June 1993
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