2 results
In situ investigation of the interfacial reaction in Sn/Cu system by synchrotron radiation
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- Journal:
- Journal of Materials Research / Volume 25 / Issue 5 / May 2010
- Published online by Cambridge University Press:
- 31 January 2011, pp. 972-975
- Print publication:
- May 2010
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Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization
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- Journal:
- Journal of Materials Research / Volume 24 / Issue 8 / August 2009
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2638-2643
- Print publication:
- August 2009
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