39 results
Effect of Interface Conditions on Yield Behavior of Passivated Copper Thin Films
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- Journal:
- Journal of Materials Research / Volume 17 / Issue 7 / July 2002
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1863-1870
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- July 2002
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Studies of Silane Adhesion Promoters on Silica Filler Particles for use in Microelectronic Packaging
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- Journal:
- MRS Online Proceedings Library Archive / Volume 710 / 2001
- Published online by Cambridge University Press:
- 17 March 2011, D10.10.1
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- 2001
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Adhesion Mechanisms of Silane Adhesion Promoters in Microelectronic Packaging
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- MRS Online Proceedings Library Archive / Volume 682 / 2001
- Published online by Cambridge University Press:
- 21 March 2011, N6.4
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- 2001
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Chemical and Structural Characterization of Silane Adhesion Promoting Films for Use in Microelectronic Packaging
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- MRS Online Proceedings Library Archive / Volume 629 / 2000
- Published online by Cambridge University Press:
- 01 February 2011, FF5.12
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- 2000
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Atomic Force Microscopy Studies of Fracture Surfaces From Oxide / Polymer Interfaces
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- MRS Online Proceedings Library Archive / Volume 654 / 2000
- Published online by Cambridge University Press:
- 21 March 2011, AA2.7.1
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- 2000
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A Detailed Study of Void Motion In Passivated Aluminum Interconnects
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- MRS Online Proceedings Library Archive / Volume 563 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 103
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- 1999
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Study of Crack Propagation at an Oxide/Polymer Interface Under Varying Loading Conditions
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- MRS Online Proceedings Library Archive / Volume 594 / 1999
- Published online by Cambridge University Press:
- 10 February 2011, 407
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- 1999
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Effect of Microstructure and Chemical Bonding on the Adhesion Strength of a Silicon/Polymer Interface for Microelectronic Packaging Applications
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- MRS Online Proceedings Library Archive / Volume 535 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 165
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- 1998
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A Quantitative Study of Void Nucleation Times in Passivated Aluminum Interconnects
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- MRS Online Proceedings Library Archive / Volume 516 / January 1998
- Published online by Cambridge University Press:
- 10 February 2011, 83
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- January 1998
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The Effects of Passivation Thickness and Initial Aluminum Line Stress on Electromigration Behavior
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- MRS Online Proceedings Library Archive / Volume 516 / January 1998
- Published online by Cambridge University Press:
- 10 February 2011, 249
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- January 1998
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In-Situ Stress Measurements During Dry Oxidation of Silicon
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- MRS Online Proceedings Library Archive / Volume 473 / 1997
- Published online by Cambridge University Press:
- 10 February 2011, 95
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- 1997
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Observation of Electromigration Voiding in Cu Lines
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- MRS Online Proceedings Library Archive / Volume 473 / 1997
- Published online by Cambridge University Press:
- 10 February 2011, 235
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- 1997
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Stress and Microstructural Evolution of Lpcvd Polysilicon Thin Films During High Temperature Annealing
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- MRS Online Proceedings Library Archive / Volume 441 / 1996
- Published online by Cambridge University Press:
- 10 February 2011, 403
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- 1996
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In-situ Measurement of Viscous Flow of Thermal Silicon Dioxide Thin Films at High Temperature
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- MRS Online Proceedings Library Archive / Volume 446 / 1996
- Published online by Cambridge University Press:
- 10 February 2011, 261
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- 1996
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Measurement and interpretation of strain relaxation in passivated Al–0.5% Cu lines
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- Journal of Materials Research / Volume 11 / Issue 1 / January 1996
- Published online by Cambridge University Press:
- 31 January 2011, pp. 184-193
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- January 1996
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Modeling Diffusion in Gallium Arsenide: Recent Work
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- MRS Bulletin / Volume 20 / Issue 4 / April 1995
- Published online by Cambridge University Press:
- 29 November 2013, pp. 41-50
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- April 1995
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Letter from the President
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- Journal:
- MRS Bulletin / Volume 19 / Issue 12 / December 1994
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- 29 November 2013, p. 3
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- December 1994
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Letter from the President
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- Journal:
- MRS Bulletin / Volume 19 / Issue 11 / November 1994
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- 29 November 2013, pp. 5-6
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- November 1994
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Elastic strain gradients and x-ray line broadening effects as a function of temperature in aluminum thin films on silicon
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- Journal of Materials Research / Volume 9 / Issue 2 / February 1994
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- 03 March 2011, pp. 328-335
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- February 1994
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Measurement and Interpretation of Strain Relaxation in Passivated Al-0.5%Cu Lines
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- Journal:
- MRS Online Proceedings Library Archive / Volume 338 / 1994
- Published online by Cambridge University Press:
- 22 February 2011, 275
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- 1994
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