6 results
Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development
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- Journal:
- Microscopy and Microanalysis / Volume 24 / Issue S1 / August 2018
- Published online by Cambridge University Press:
- 01 August 2018, pp. 618-619
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- August 2018
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In situ investigation of the interfacial reaction in Sn/Cu system by synchrotron radiation
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- Journal:
- Journal of Materials Research / Volume 25 / Issue 5 / May 2010
- Published online by Cambridge University Press:
- 31 January 2011, pp. 972-975
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- May 2010
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Formation mechanism of Sn-patch between SnAgCu solder and Ti/Ni(V)/Cu under bump metallization
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- Journal:
- Journal of Materials Research / Volume 24 / Issue 8 / August 2009
- Published online by Cambridge University Press:
- 31 January 2011, pp. 2638-2643
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- August 2009
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Phase Equilibria in the Sn-Rich Corner of the Sn–Cu–Ni Ternary Alloy System at 240 °C
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- Journal:
- Journal of Materials Research / Volume 20 / Issue 11 / November 2005
- Published online by Cambridge University Press:
- 03 March 2011, pp. 3118-3124
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- November 2005
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High-temperature MgO–C–Al refractories–metal reactions in high-aluminum-content alloy steels
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- Journal:
- Journal of Materials Research / Volume 18 / Issue 8 / August 2003
- Published online by Cambridge University Press:
- 31 January 2011, pp. 1950-1959
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- August 2003
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Interface reactions and phase equilibrium between Ni/Cu under-bump metallization and eutectic SnPb flip-chip solder bumps
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- Journal:
- Journal of Materials Research / Volume 18 / Issue 4 / April 2003
- Published online by Cambridge University Press:
- 06 January 2012, pp. 935-940
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- April 2003
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