5 results
Adhesion Strength and Microstructure of Cu/Ni/OsOx/glass Structure for Highly-Reliable Cu Interconnection
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1559 / 2013
- Published online by Cambridge University Press:
- 03 July 2013, mrss13-1559-aa08-03
- Print publication:
- 2013
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Copper Deposition Technology for Thru Silicon Via Formation Using Supercritical Carbon Dioxide Fluids Using a Flow Type Reaction System
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- Journal:
- MRS Online Proceedings Library Archive / Volume 1156 / 2009
- Published online by Cambridge University Press:
- 31 January 2011, 1156-D08-07-F06-07
- Print publication:
- 2009
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Novel [Topography-Sensitive] Bottom-Up Growth of Ruthenium and Copper for Filling Nano-Features Using Supercritical Co2 Fluids: Beyond Scalability
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- Journal:
- MRS Online Proceedings Library Archive / Volume 992 / 2007
- Published online by Cambridge University Press:
- 01 February 2011, 0992-D02-03
- Print publication:
- 2007
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The Control and Impact of Processing Ambient During RTP
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- Journal:
- MRS Online Proceedings Library Archive / Volume 514 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 239
- Print publication:
- 1998
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In-Line Ambient Impurity Measurement on a Rapid Thermal Process Chamber by Atmospheric Pressure Ionisation Mass Spectrometry
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- Journal:
- MRS Online Proceedings Library Archive / Volume 525 / 1998
- Published online by Cambridge University Press:
- 10 February 2011, 51
- Print publication:
- 1998
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