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Novel [Topography-Sensitive] Bottom-Up Growth of Ruthenium and Copper for Filling Nano-Features Using Supercritical Co2 Fluids: Beyond Scalability

Published online by Cambridge University Press:  01 February 2011

Eiichi Kondoh ,
M. Hirose ,
E. Ukai  and
K. Nagano
Eiichi Kondoh
Affiliation:
kondoh@ccn.yamanashi.ac.jp, University of Yamanashi, Interdisciplinary graduate schoold of medicine and engineering, Takeda 4-3-11, Kofu, 400-8511, Japan
M. Hirose
Affiliation:
kondoh@ccn.yamanashi.ac.jp, University of Yamanashi, Interdisciplinary Graduate School of Medicine and Engineering, Takeda 4-3-11, Kofu, 400-8511, Japan
E. Ukai
Affiliation:
kondoh@ccn.yamanashi.ac.jp, University of Yamanashi, Interdisciplinary Graduate School of Medicin e and Engineering, Takeda 4-3-11, Kofu, 400-8511, Japan
K. Nagano
Affiliation:
kondoh@ccn.yamanashi.ac.jp, University of Yamanashi, Faculty of Engineering, Takeda 4-3-11, Kofu, 400-8511, Japan
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Abstract

A novel selective and bottom-up deposition process from supercritical CO2 is proposed and demonstrated. Supercritical CO2 fluids are dense media, and a deposition precursor dissolving wherein can easily condences in hollow/concave features. By combining this capillary condensation phenomenon with proper reaction chemistry, it was realized to deposit Ru an Cu in holes and trenches structures preferentially. The capillary condensation occurs better in the narrower features, we call this method “gtopography-sensitive” selective deposition technique.

Keywords

CuRunucleation & growth
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 992: Symposium D – Deposition on Nonplanar Substrates , 2007 , 0992-D02-03
Copyright
Copyright © Materials Research Society 2007

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