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Improvement of X-ray stress measurement from a Debye–Scherrer ring by oscillation of the X-ray incident angle

Published online by Cambridge University Press:  12 August 2015

Toshiyuki Miyazaki*
Affiliation:
Kanazawa Universiyt, Kanazawa city, 920-1165, Japan
Yoichi Maruyama
Affiliation:
Kanazawa Universiyt, Kanazawa city, 920-1165, Japan
Yohei Fujimoto
Affiliation:
Kanazawa Universiyt, Kanazawa city, 920-1165, Japan
Toshihiko Sasaki
Affiliation:
Kanazawa Universiyt, Kanazawa city, 920-1165, Japan
*
a)Author to whom correspondence should be addressed. Electronic mail: trmiyazaki@staff.kanazawa-u.ac.jp

Abstract

A technique to improve the stress measurement from a Debye–Scherrer ring (D–S ring) is reported. In a previous work, the authors reported a technique to calculate stress from the Fourier series of the normal strain of a D–S ring. That technique, similar to the cosα method that came before it, is inaccurate when the grain size of the specimen is relatively large. To cope with this problem, the authors propose using the oscillation of the X-ray incident angle. The present study demonstrates this technique to improve the stress measurement.

Type
Technical Articles
Copyright
Copyright © International Centre for Diffraction Data 2015 

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References

Lode, W. and Peiter, A. (1981). “X-ray-measurable deformations in superficial layers and their representations,” Materialpruefung 23, 227230.Google Scholar
Maruyama, Y. Ph.D thesis, Kanazawa University (In progress, 2015).Google Scholar
Miyazaki, T. and Sasaki, T. (2014). “X-ray stress measurement with two-dimensional detector based on Fourier analysis,” Int. J. Mater. Res. 105, 922927.Google Scholar
Miyazaki, T. and Sasaki, T. (2015). “X-ray stress measurement from an imperfect Debye–Scherrer ring,” Int. J. Mater. Res. 106, 3:237241.Google Scholar
Noyan, I. C. and Cohen, J. B. (1987). Residual Stress (Springer-Verlag, New York).Google Scholar
Sasaki, T., Hirose, Y., and Yasukawa, S. (1997). “X-ray stress measurement of coarse-grained polycrystalline materials by imaging plate method,” Trans. Jpn. Soc. Mech. Eng. Part A. 63, 533541.Google Scholar
Taira, S., Tanaka, K., and Yamasaki, T. (1978). “A method of x-ray microbeam measurement of local stress and its application to fatigue crack growth problem,” J. Soc. Mat. Sci, Japan. 27, 251256.Google Scholar
Welzel, U., Ligot, J., Lamparter, P., Vermeulen, A. C., and Mittermeijer, E. J. (2005). “Stress analysis of polycrystalline thin films and surface regions by X-ray diffraction,” J. Appl. Crystallogr. 38, 129.Google Scholar