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Cross-Section Nano-Indentation for Rapid Adhesion Evaluation

Published online by Cambridge University Press:  17 March 2011

S. H. Brongersma
Affiliation:
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
Dominiek Degryse
Affiliation:
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
Jerome Souiller
Affiliation:
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
Bart Vandevelde
Affiliation:
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
K. Maex
Affiliation:
IMEC, Kapeldreef 75, B-3001 Leuven, Belgium K.U.Leuven, ESAT, Kasteelpark Arenberg 10, B-3001 Leuven, Belgium
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Abstract

Cross-section nano-indentation is a technique that consists of cleaving a wafer, indenting behind the stack on the side surface causing delamination, and measuring the delaminated area in an optical microscope. It is shown to be a reliable rapid technique for adhesion evaluation and process optimization of the SiO2/barrier/copper stack.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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References

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